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首页> 外文期刊>Journal of thermal stresses >A sub-interface thermal crack problem for bonded dissimilar plates with interfacial thermal resistance
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A sub-interface thermal crack problem for bonded dissimilar plates with interfacial thermal resistance

机译：具有界面热阻的异种粘结板的子界面热裂纹问题

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摘要

The present work aims to investigate the effect of interfacial thermal resistance on thermal fracture behavior of bonded and composite materials. We consider a sub-interface crack parallel to the interface between two semi-infinite dissimilar plates subjected to remote heat flux thermal loading. A constant thermal resistance is assumed to exist along the interface. The temperature distribution along the crack, the thermal stress intensity factors (TSIFs), and the crack opening/sliding displacements (COD/CSD) are obtained using an integral transform/superposition method. The numerical results for Al2O3/Si3N4 bimaterial systems show that the magnitude of the mode I TSIF generally decreases with increasing thermal resistance of the interface but increases with increasing thermal resistance for cracks that are very close to the interface. On the other hand, the model II TSIF increases with increasing thermal resistance if the crack is in the Al2O3 semi-infinite plate, and decreases if the crack is in the Si3N4 semi-infinite plate. The COD/CSD are also significantly influenced by the thermal resistance of the interface.
机译：本工作旨在研究界面热阻对粘结材料和复合材料热断裂行为的影响。我们考虑了一个平行于两个半无限异种板之间的界面的子界面裂纹，该两个半无限相异的平板受到远距离热通量热负荷。假定沿界面存在恒定的热阻。使用积分变换/叠加方法获得沿裂纹的温度分布，热应力强度因子（TSIF）和裂纹的开/滑位移（COD / CSD）。 Al2O3 / Si3N4双材料系统的数值结果表明，模式I TSIF的大小通常随着界面热阻的增加而减小，但对于非常接近界面的裂纹，其模数随热阻的增加而增加。另一方面，如果裂纹在Al2O3半无限大的平板中，则模型II TSIF随热阻的增加而增加，如果裂纹在Si3N4半无限大的平板中则减小。接口的热阻也会极大地影响COD / CSD。

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