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首页> 外文期刊>Journal of thermal stresses >TRANSIENT HEAT CONDUCTION AND ANALYSIS OF THERMAL STRESSES IN THIN CIRCULAR PLATE
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TRANSIENT HEAT CONDUCTION AND ANALYSIS OF THERMAL STRESSES IN THIN CIRCULAR PLATE

机译：薄圆板中的瞬态传热与热应力分析

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In this paper, the solution of the problem of transient heat conduction in a thin circular plate subjected to some different types of boundary conditions is obtained in the form of infinite series by employing the integral transform technique. It is assumed that the plate is in the plane state of stress and initially the temperature of the plate is kept at zero. The first type of boundary condition is that in which a linear combination of temperature and its normal derivative is prescribed on the circular edge as well as on the plane surfaces of the plate. Using the expression for the temperature function, we determine the displacement function and stresses within the plate. The second type of boundary condition is that in which the upper surface is kept at arbitrary temperature, lower surface is kept at zero and circular edge is insulated. Two other problems involving boundary conditions similar to those of the second type are also discussed.
机译：本文采用积分变换技术，以无穷级数的形式，获得了边界条件不同的圆形薄板瞬态热传导问题的解决方案。假定板处于应力的平面状态，并且最初板的温度保持在零。第一类边界条件是在板的圆形边缘和平面上规定温度及其正态导数的线性组合。使用温度函数的表达式，我们可以确定板中的位移函数和应力。第二种边界条件是上表面保持在任意温度，下表面保持在零，圆形边缘绝缘。还讨论了另外两个涉及边界条件的问题，这些问题与第二种类似。

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