首页> 外文会议>10th International congress on thermal stresse >Mathematical Analysis of Plane Axisymmetric Transient Heat Conduction and Thermal Stresses of a Compound Circular Plate Subjected to Concentrated Sunlight
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Mathematical Analysis of Plane Axisymmetric Transient Heat Conduction and Thermal Stresses of a Compound Circular Plate Subjected to Concentrated Sunlight

机译:日光下复合圆板平面轴对称瞬态热传导和热应力的数学分析。

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摘要

The present study is intended to evaluate heat conduction and mechanical strength at elevatedtemperature of a flat type receiver from a theoretical viewpoint.Considering a compound circular platecomposed of layers of different kinds of materials as an analytical model of a flat type receiver,amathematical analysis of plane axisymmetric transient heat conduction and thermal stresses for the plateis treated.An effect of thickness of layers on spatial variations and time-evolution of temperature changeand thermal stresses is discussed briefly for a compound circular plate composed of carbon steel layer andcopper one.
机译:本研究旨在从理论的角度评估平板型接收器在高温下的热传导和机械强度。将由不同材料组成的复合圆板作为平板型接收器的分析模型,对平面进行数学分析简要讨论了层厚对碳钢层和铜复合层组成的复合圆板的空间变化以及温度变化和热应力随时间的变化的影响。

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