Effect of Pd ions in the chemical etching solution

Guixiang Wang; Ning Li; Deyu Li

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Effect of Pd ions in the chemical etching solution

机译：Pd离子在化学腐蚀液中的作用

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The acrylonitrile-butadiene-styrene (ABS) surface was etched by dipping it into chromic acid-sulfuric acid containing a trace amount of palladium. The surface roughness, activity, and valence bond were characterized by atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). The results showed that with the increase of Pd concentration in the etching solution the ABS surface roughness reduced. The ratio of O to C increases and forms a large amount of O=C—O functional groups by dipping into Pd contained etching solution, thus the amount of colloids palladium adsorption increases. The carboxyl group acts as the adsorption site for the Pd/Sn catalyst.

机译：通过将丙烯腈-丁二烯-苯乙烯（ABS）表面浸入含有痕量钯的铬酸-硫酸中进行蚀刻。通过原子力显微镜（AFM）和X射线光电子能谱（XPS）对表面粗糙度，活性和价键进行了表征。结果表明，随着蚀刻液中Pd浓度的增加，ABS表面粗糙度降低。 O与C的比例增加，并且通过浸入含Pd的蚀刻溶液中而形成大量的O = CO功能基，因此胶体对钯的吸附量增加。羧基充当Pd / Sn催化剂的吸附位点。

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来源
《Journal of University of Science and Technology Beijing》 |2007年第3期|p.286-289|共4页
作者
Guixiang Wang; Ning Li; Deyu Li;
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作者单位

Applied Chemistry Department, Harbin Institute of Technology, Harbin 150001, China;

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原文格式 PDF
正文语种 eng
中图分类 Tf;
关键词
ABS plastic; etching; palladium; XPS; AFM;

机译：ABS塑料;蚀刻;钯;XPS;AFM;

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Effect of Pd ions in the chemical etching solution

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