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首页> 外文期刊>Key Engineering Materials >Effect of Rapid-Feed Step-Drilling Cycle and Super-High-Speed Spindle for High-Speed Micro Drilling in Printed Wiring Boards
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Effect of Rapid-Feed Step-Drilling Cycle and Super-High-Speed Spindle for High-Speed Micro Drilling in Printed Wiring Boards

机译：快速进给分步钻孔循环和超高速主轴对印刷线路板中的高速微钻孔的影响

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摘要

A drilling technique using micro-drills of 0.2 mm or less in diameter and a super-high-speed spindle of 160000 rpm or more has been developed for drilling ultra-micro holes in printed wiring boards (PWBs). The drilling process requires higher reliability and quality to maintain the reliability of the electrical connection between circuit layers. On the other hand, higher processing efficiency is also required in PWBs manufacturing. To maintain high productivity, drilling is normally performed using a non-step method, but heat damage called B-RING occurs around the drilled holes with this method. To solve these problems without the loss of processing efficiency, we applied the rapid-feed step-drilling cycle method. We investigated the B-RING for drilling quality and evaluated the drilling time for processing efficiency under various drilling conditions. We found that using a rapid-feed step-drilling cycle with an appropriate number of steps and feed rates ensures a higher level of hole quality and processing efficiency compared with the conventional non-step drilling.
机译：已经开发了使用直径为0.2mm或更小的微钻和160000rpm或更高的超高速主轴的钻削技术，以在印刷线路板（PWB）中钻超微孔。钻孔过程需要更高的可靠性和质量，以保持电路层之间电连接的可靠性。另一方面，在PWB制造中也需要更高的处理效率。为了保持较高的生产率，通常使用非步进方法进行钻孔，但是使用此方法会在钻孔周围产生称为B-RING的热损伤。为了解决这些问题而又不损失加工效率，我们采用了快速进给分步钻孔循环法。我们调查了B-RING的钻孔质量，并评估了在各种钻孔条件下的钻孔时间以提高加工效率。我们发现，与常规的非分步钻孔相比，使用具有适当步数和进给速度的快速进给分步钻孔循环可确保更高水平的孔质量和加工效率。

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