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Effect of High Glass Transition Temperature on Reliability of Non-Conductive Film (NCF)

机译：高玻璃化转变温度对非导电膜（NCF）可靠性的影响

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摘要

Among many factors that influence the reliability of a flip-chip assembly using NCF interconnections, the most effective parameters are often the coefficient of thermal expansion (CTE), the modulus (E), and the glass transition temperatures (Tg). Of these factors, the effect of Tg on thermal deformation and device reliability is significant; however, it has not been shown clearly what effect Tg has on the reliability of NCF. The Tg of a conventional NCF material is approximately 110℃. In this study, a new high Tg NCF material that has a 140℃ Tg is proposed. The thermal behaviors of the conventional and new NCFs between -40℃ to 150℃ are observed using an optical method. Twyman-Green interferometry and the moire interferometry method are used to measure the thermal micro-deformations. The Twyman-Green interferometry measurement technique is applied to verify the stress-free state. The stress-free temperatures of the conventional and new Tg NCF materials are approximately 100℃ and 120℃ respectively. A shear strain at a part of the NCF chip edge is measured by moire interferometry. Additionally, a method to accurately measure the residual warpage and shear strain at room temperature is proposed. Through the analysis of the relationship between the warpage and the shear strain, the effect of the high-Tg NCF material on the reliability is studied.
机译：在许多影响使用NCF互连的倒装芯片组件可靠性的因素中，最有效的参数通常是热膨胀系数（CTE），模量（E）和玻璃化温度（Tg）。在这些因素中，Tg对热变形和器件可靠性的影响非常明显。然而，尚未清楚地表明Tg对NCF的可靠性有什么影响。常规NCF材料的Tg约为110℃。在这项研究中，提出了一种具有140℃Tg的新型高Tg NCF材料。使用光学方法观察了传统NCF和新型NCF在-40℃至150℃之间的热行为。 Twyman-Green干涉测量法和莫尔干涉测量法用于测量热微变形。 Twyman-Green干涉测量技术用于验证无应力状态。常规和新型Tg NCF材料的无应力温度分别约为100℃和120℃。通过莫尔干涉测量法测量NCF芯片边缘的一部分处的剪切应变。此外，提出了一种在室温下准确测量残余翘曲和剪切应变的方法。通过分析翘曲与剪切应变之间的关系，研究了高Tg NCF材料对可靠性的影响。

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