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Damage Assessment in Bonded Composite Joints

机译：粘结复合材料接头的损伤评估

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摘要

The initiation and accumulation of damage in adhesively bonded joints is of importance in developing physically realistic failure models. However, this has been little studied to date, particularly with respect to complex forms of loading. In this paper a number of methods of studying damage and crack propagation in bonded composite lap joints subjected to fatigue loading are investigated. It is shown that dye penetrant enhanced x-radiography is capable of distinguishing between, cracked, micro-damaged and undamaged areas of the joints and moreover it is clearly seen that large damage zones can form ahead of the crack tip and that these are dependent on the sample and loading conditions. The main drawback of this technique was the need to remove the sample from the test machine and soak in a dye solution prior to the x-radiography. For this reason electronic speckle pattern shearing Interferometry (ESPSI) was also studied. This was shown to be capable of in-situ detection of the location of the crack front but further analysis is required to determine how effective the technique is at monitoring damage zones.
机译：在开发物理逼真的失效模型时，粘合接头的损伤的引发和累积非常重要。但是，到目前为止，这还很少进行研究，特别是对于复杂的加载形式。本文研究了许多研究疲劳载荷作用下的复合搭接接头的损伤和裂纹扩展的方法。结果表明，染料渗透增强型X射线照相技术能够区分接头的裂纹，微损伤和未损伤区域，此外，可以清楚地看到，在裂纹尖端之前可能会形成较大的损伤区域，并且这些损伤区域取决于样品和上样条件。该技术的主要缺点是需要在X射线照相之前从测试仪中取出样品并浸泡在染料溶液中。因此，还对电子散斑图案剪切干涉仪（ESPSI）进行了研究。已表明它能够原位检测裂纹前沿的位置，但需要进一步分析以确定该技术在监测损伤区域方面的有效性。

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