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首页> 外文期刊>Composite Structures >Quality assessment and damage detection in nanomodified adhesively-bonded composite joints using inkjet-printed interdigital sensors
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Quality assessment and damage detection in nanomodified adhesively-bonded composite joints using inkjet-printed interdigital sensors

机译:使用喷墨印刷叉指式传感器的纳米改性胶粘复合接头的质量评估和损伤检测

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摘要

In this work, the development of a planar interdigital capacitive sensor, directly onto the surface of a composite, for determining the initial quality of curing of bonded composite joints and assessing their long-term durability is presented. The sensor consisted of an interlocking comb-shaped array of silver electrodes and used to monitor the progress of cure of an adhesive resin and the subsequent damage state of the bond line in adhesively-bonded composite joints using impedance spectroscopy. The obtained results from the mechanical characterization indicated that the developed sensor did not affect the quality of the bondline while the added weight of the sensor is negligible. The curing process of the adhesive epoxy was successfully monitored while the ability of the sensor to assess the developed damage created by the mechanical loading was confirmed using transient infrared thermography.
机译:在这项工作中,提出了一种直接在复合材料表面上的平面叉指式电容传感器的开发,用于确定粘合复合材料接头的固化初始质量并评估其长期耐久性。该传感器由一个互锁的梳状银电极阵列组成,用于通过阻抗光谱法监测粘合树脂的固化进度以及粘合复合材料接头中粘合线的后续损坏状态。通过机械表征获得的结果表明,虽然传感器的增加重量可以忽略不计,但开发的传感器不会影响粘合线的质量。使用瞬态红外热成像技术可以成功监测粘合剂环氧树脂的固化过程,同时确认传感器评估机械负载造成的损坏的能力。

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