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Evaluation of Fatigue Life in Microelectronics Solder Joints of a Surface-Mounted Type

机译：表面安装型微电子焊点的疲劳寿命评估

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摘要

Fatigue tests on solder joints of surface-mounted type electronic package models were carried out at different temperatures, cycling frequencies and controlled displacement amplitudes in order to examine the crack initiation life Nc, crack extension path, crack extension rate da/dN and fatigue life Nf. The crack initiation life (Nc)_(cal) of solder joints were estimated in terms of maximum equivalent inelastic strain calculated by a three-dimensional elasto-inelastic finite element method (3D-FEM). The ratios Nc/(Nc)_(cal) were found to be 1.26 to 6.46. To examine crack extension behaviors, 2D-FEM were performed using Delaunay Triangulation technique. The FEM results showed that crack extension path and rate were controlled by maximum opening stress range at the crack tip, Δ σ θ_(max). The crack extension rate was experimentally found to be related to Δ σ θ_(max) as da/dN = β [Δ σ θ_(max)]~α, with α = 2.0 and β =2.6 · 10~(-7) mm~5/N~2 determined independently by the test conditions. The calculated number of cycles to failure was in good agreement with the experimental result.
机译：为了检查裂纹萌生寿命Nc，裂纹扩展路径，裂纹扩展率da / dN和疲劳寿命Nf，在不同温度，循环频率和受控位移幅度下对表面安装式电子封装模型的焊点进行了疲劳测试。 。焊点的裂纹萌生寿命（Nc）_（cal）是根据通过三维弹塑性有限元方法（3D-FEM）计算出的最大等效无弹性应变来估算的。发现比率Nc /（Nc）_（cal）为1.26至6.46。为了检查裂纹扩展行为，使用Delaunay Triangulation技术执行了2D-FEM。有限元分析结果表明，裂纹扩展路径和扩展速率受裂纹尖端的最大张应力范围Δσθ_（max）控制。实验发现，当da / dN =β[Δσθ_（max）]〜α时，裂纹扩展率与Δσθ_（max）有关，其中α= 2.0和β= 2.6·10〜（-7）mm 〜5 / N〜2由测试条件独立确定。计算得出的故障循环次数与实验结果非常吻合。

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