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Super Kfc Series And Klf170 Copper Alloys For Leadframes

机译：引线框用超级Kfc系列和Klf170铜合金

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Leadframes contribute to the high reliability and high performance of semiconductor packages. Raw materials of leadframes require good stamping formability, etching formability and platability, along with strength and electrical conductivity. Conventional QFPs (Quad Flat Packages) are being replaced by QFNs (Quad Flat Non-leaded packages), which are easier to downsize. The QFNs require excellent dice formability (dicing) because of their manufacturing process. Kobe Steel developed copper alloys, namely "super KFC series" and "KLF170", in response to the advent of the QFNs.rnThe Super KFC (SPKFC) alloys are a series developed for thinner and larger leadframes, based on KFC (C19210) alloy of which more than 4,000 tonne/month is produced worldwide.rnThe KLF170 alloy is the first Cu-Ni-P alloy in the world, which is mass-produced for electronic applications.This alloy is featured by high strength and high electrical conductivity to ensure quality and reliability of packages. The alloy has no large precipitates in its raw material and no smut occurring during the pre-plating processes, which used to be problems in the conventional high-strength alloys.
机译：引线框有助于半导体封装的高可靠性和高性能。引线框的原材料需要良好的冲压成形性，蚀刻成形性和可电镀性，以及强度和导电性。传统的QFP（四方扁平封装）被QFN（四方扁平无铅封装）所取代，QFN易于减小尺寸。由于QFN的制造工艺，它们需要出色的芯片成型性（切割）。神户制铁为响应QFN的问世开发了铜合金，即“超级KFC系列”和“ KLF170”。 KLF170合金是世界上第一种Cu-Ni-P合金，已大量生产用于电子应用，该合金具有高强度和高电导率的特点，可确保每月生产超过4,000吨/月。包装的质量和可靠性。该合金在其原料中没有大的沉淀，在预镀过程中也不会出现黑斑，这在常规的高强度合金中曾经是个问题。

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    《Kobelco technology review》 |2007年第27期|77|共1页
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