Trends in surface finishing and materials for leadframes

Nobuaki Isono; Toshihisa Hara; Hiroshi Sakamoto

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Trends in surface finishing and materials for leadframes

机译：引线框架的表面处理和材料趋势

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Recent trends in surface finishing on leadframes and the materials we have developed to meet these demands are summarized. One of the main objectives of leadframe surface finishing technology is elimination of the platings on inner leads to save cost and time, particularly for silver plating. For transistors and some Ics, bar bonding technology, the technology to bond LSSI chips and wires directly on to bare leadframes, has Been widely adopted.

机译：总结了引线框架表面精加工的最新趋势以及我们为满足这些要求而开发的材料。引线框表面精加工技术的主要目标之一是消除内部引线上的镀层，以节省成本和时间，尤其是对于镀银而言。对于晶体管和某些集成电路，条焊技术是将LSSI芯片和导线直接粘合到裸引线框架上的技术，已被广泛采用。

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《Kobelco Technology Review》 |1997年第19期|p.23-26|共4页
作者
Nobuaki Isono; Toshihisa Hara; Hiroshi Sakamoto;
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正文语种 eng
中图分类冶金工业;
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Trends in surface finishing and materials for leadframes

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