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Microstructure and hot deformation behavior of a new aluminum-lithium-copper based AA2070 alloy

机译：新型铝锂铜基AA2070合金的组织和热变形行为

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The effects of initial microstructure on hot compression behavior of a new Al-Li-Cu alloy AA2070 were studied in the temperature range of 250 ℃-450 ℃ and strain rate range of 0.001 s~(-1) - 0.1 s~(-1). Scanning electron microscopy (SEM), electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM) were used to characterize microstructure prior to and post deformation. Two types of major strengthening precipitates were identified: Al_2CuLi (T1) phase with habit planes parallel to {111}_(Al) and Al_2Cu/Al_3Li (θ'/δ') composite precipitates with habit planes parallel to {100}_(Al), in the initial microstructure. The combination of these precipitates provides strong resistance to dislocation slip. While dynamic recovery is the main softening mechanism at compression temperatures below 450 ℃, dynamic recrystallization dominates softening at 450 ℃. Tl precipitate bands consisting of multiple fine T1 precipitates exist in microstructure after hot deformation at 250 ℃ and 350 ℃. The formation mechanisms of T1 precipitate bands and fine T1 precipitates are discussed in light of shearing deformation of T1 precipitates. After hot deformation at 350 ℃, θ'/δ' composite structure is lost and only θ' precipitates exist in the post-deformation microstructure. The interface between θ' precipitate and aluminum matrix becomes incoherent. The optimal processing conditions of this alloy have been identified as a temperature of 450 ℃ and a strain rate of 0.001 s~(-1), with significant grain refinement and the weakest deformation texture, which are consistent with the analysis results of hot work efficiency and instability using pseudo processing maps.
机译：研究了初始微观组织对新型Al-Li-Cu合金AA2070在250℃-450℃温度范围和0.001 s〜（-1）-0.1 s〜（-1）范围内热压缩行为的影响。 ）。扫描电子显微镜（SEM），电子反向散射衍射（EBSD）和透射电子显微镜（TEM）用于表征变形前后的微观结构。确定了两种主要的强化析出物类型：习惯面平行于{111} _（Al）的Al_2CuLi（T1）相和习惯面平行于{100} _（Al的Al_2Cu / Al_3Li（θ'/δ'）复合析出物），在最初的微观结构中。这些沉淀物的结合提供了对位错滑移的强抵抗力。在450℃以下的压缩温度下，动态恢复是主要的软化机理，而在450℃，动态再结晶占主导地位。在250℃和350℃高温变形后，显微组织中存在由多个T1细小析出物组成的T1析出带。针对T1析出物的剪切变形，探讨了T1析出物谱带和细T1析出物的形成机理。在350℃热变形后，θ'/δ'复合结构消失，变形后的组织中仅存在θ'析出物。 θ'析出物与铝基体之间的界面变得不连贯。确定该合金的最佳加工条件为温度为450℃，应变速率为0.001 s〜（-1），晶粒细化明显，变形织构最弱，与热加工效率的分析结果相吻合。以及使用伪处理图的不稳定性。

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