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Low-temperature metal-to-alumina direct bonding process utilizing redox reaction between silver oxide and organic agent

机译：利用氧化银与有机试剂之间的氧化还原反应的低温金属与氧化铝直接键合工艺

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摘要

In the present study, low temperature bonding of gold-to-alumina was investigated by the in situ generation of silver via a redox reaction between silver oxide microparticles and diethylene glycol. The shear strength of gold-to-alumina joints with a silver layer bonded at 400 ℃ was comparable to that of conventional methods that require a high bonding temperature. Microstructural observations revealed that the adhesion of silver nano-particles, which are formed by redox reaction, on an alumina surface improves the strength leading to the fracture of alumina. High-resolution transmission electron microscopy and energy dispersive spectroscopy analysis showed the direct bonding between silver and alumina at the interface without diffusion or formation of a reaction layer. Additionally, x-ray photoelectron spectroscopy analysis at the interface showed that the bonding of silver and alumina could be attributed to the silver-oxygen bond, which revealed that silver ions generated during the redox reaction could contribute to the bond formation. Further, molecular dynamics simulation confirmed that the presence of silver ions promotes the formation of an initial silver layer, which plays a role in bonding silver nanoparticles to an alumina surface. As mentioned above, it was found that a bonding method utilizing the reduction of silver oxide by reducing agent involves a significant, unique process that realizes metal-to-alumina bonding at a low temperature.%Low-temperature bonding; Silver nanostructures; Sintering; Redox reaction; Alumina; Microstructure
机译：在本研究中，通过氧化银微粒与二甘醇之间的氧化还原反应原位生成银来研究金与氧化铝的低温键合。在400℃粘结银层的金铝接头的剪切强度与要求高粘结温度的传统方法相当。微观结构观察表明，通过氧化还原反应形成的银纳米颗粒在氧化铝表面上的粘附提高了导致氧化铝断裂的强度。高分辨率透射电子显微镜和能量色散光谱分析表明，银和氧化铝之间在界面处直接键合而没有扩散或形成反应层。此外，在界面上的X射线光电子能谱分析表明，银和氧化铝的键合可以归因于银-氧键，这表明在氧化还原反应过程中产生的银离子可能有助于键的形成。此外，分子动力学模拟证实银离子的存在促进了初始银层的形成，这在将银纳米颗粒结合到氧化铝表面上起作用。如上所述，发现利用还原剂还原氧化银的键合方法涉及显着，独特的工艺，该工艺可在低温下实现金属与氧化铝的键合。银纳米结构；烧结;氧化还原反应；氧化铝;微观结构

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  • 来源
    《Materials Science and Engineering》 |2017年第15期|398-405|共8页
  • 作者

    Koji Asama; Tomoki Matsuda; Tomo Ogura; Tomokazu Sano; Makoto Takahashi; Akio Hirose;

  • 作者单位

    Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

    Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

    Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

    Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

    Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan;

    Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Low-temperature bonding; Silver nanostructures; Sintering; Redox reaction; Alumina; Microstructure;

    机译：低温粘接;银纳米结构;烧结;氧化还原反应;氧化铝;微观结构;

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