Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid

著录项

• 来源
  《Materials Science and Engineering》 |2014年第8期|372-378|共7页
• 作者

  Wen-Hua Li; Pei-Syuan Lin; Chen-Ni Chen; Teng-Yuan Dong; Chi-Hang Tsai; Wan-Ting Kung; Jenn-Ming Song; Ying-Ta Chiu; Ping-Feng Yang;

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• 作者单位

  Department of Chemistry, Center for Nanoscience and Nanotechnology, National Sun Yat-Sen University, Kaohsiung, Taiwan;

  Department of Chemistry, Center for Nanoscience and Nanotechnology, National Sun Yat-Sen University, Kaohsiung, Taiwan;

  Department of Chemistry, Center for Nanoscience and Nanotechnology, National Sun Yat-Sen University, Kaohsiung, Taiwan;

  Department of Chemistry, Center for Nanoscience and Nanotechnology, National Sun Yat-Sen University, Kaohsiung, Taiwan;

  Graduate Institute of Applied Science and Technology, National Taiwan University of Science and Technology, Taipei, Taiwan;

  Department of Materials Science and Engineering, National Chung Hsing University, Taichung, Taiwan;

  Department of Materials Science and Engineering, National Chung Hsing University, Taichung, Taiwan;

  Advanced Semiconductor Engineering Group, No. 26, Chin 3rd Road, Nantze Export Processing Zone, Kaohsiung, Taiwan;

  Advanced Semiconductor Engineering Group, No. 26, Chin 3rd Road, Nantze Export Processing Zone, Kaohsiung, Taiwan;

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• 收录信息
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  Bonding material; Copper-to-copper bonding; Silver; Nanoparticles; Interconnection;

  机译：粘接材料;铜铜键合;银;纳米颗粒;互连;