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Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude

机译：Sn-4Ag / Cu焊点在低应变幅度下的热疲劳行为

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摘要

Thermal fatigue behaviors of the Sn-4Ag/Cu solder joints were investigated in this study. The solder joints were clamped by special designed clamps and cycled at low temperature amplitudes, their deformation morphologies were observed by Scanning Electron Microscope (SEM) and evolution in microstructures of the solder were characterized using Electron Back-scattered Diffraction (EBSD). The results reveal that the thermal fatigue process consists of a strain hardening stage and a consequent accelerating fracture stage. During the initial cycles, strain hardening of the solder keeps developing, until it becomes balance with the dynamic recovery. Due to the strain concentration, damage of the solder around the joint interface is serious and cannot release through recovery, inducing microcracks at the corner of the solder joint. After that, the nominal strength of the solder joint decreases gradually, and the damage rate accelerates with increasing cycles. The fracture surface also consists of two regions, one is covered by trace of friction and the other is similar to the shear fracture surface. Plastic deformation, grain rotation and grain coalesce occur in the solder during the thermal fatigue process, while grain subdivision or recrystallization was not observed, because the dynamic recovery keeps the strain energy of the solder at a low level.
机译：在这项研究中，研究了Sn-4Ag / Cu焊点的热疲劳行为。焊点由特殊设计的夹具夹持，并在低温振幅下循环，通过扫描电子显微镜（SEM）观察其变形形态，并利用电子背散射衍射（EBSD）表征焊锡微观结构的演变。结果表明，热疲劳过程包括应变硬化阶段和随之而来的加速断裂阶段。在初始循环中，焊料的应变硬化一直在发展，直到与动态恢复达到平衡为止。由于应变集中，焊点周围的焊料损坏严重，无法通过恢复释放，从而在焊点角处产生微裂纹。此后，焊点的标称强度逐渐降低，并且损坏率随着循环次数的增加而加速。断裂表面还包括两个区域，一个区域被摩擦痕迹覆盖，另一个区域类似于剪切断裂表面。在热疲劳过程中，焊料中发生塑性变形，晶粒旋转和晶粒聚结，而未观察到晶粒细分或再结晶，因为动态恢复将焊料的应变能保持在较低水平。

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  • 来源
    《Materials Science and Engineering》 |2013年第15期|374-384|共11页
  • 作者

    Q.K. Zhang; Z.F. Zhang;

  • 作者单位

    Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, PR China,State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, PR China;

    Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, PR China;

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  • 正文语种 eng
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  • 关键词

    Sn-Ag/Cu solder joints; Thermal fatigue; Strain localization; Grain rotation; Dynamic recovery;

    机译：Sn-Ag / Cu焊点;热疲劳;应变局部化;谷物旋转;动态恢复;

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