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Microstructure and damping behaviour of consolidated magnesium chips

机译：固结镁屑的微观结构和阻尼行为

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摘要

Chips produced by turning a commercial grade pure magnesium billet were consolidated by solid state recycling technique of cold compaction followed by hot extrusion. The cold compacted billets were extruded at four different temperatures: 250 ℃, 300 ℃, 350 ℃ and 400 ℃ For the purpose of comparison, cast magnesium (pure) billets were extruded under similar conditions. Extruded products were characterized for damping properties. Damping capacity and dynamic modulus was measured as a function of time and temperature at a fixed frequency of 5 Hz 10 to 14% increase in damping capacity was observed in chip consolidated products compared to reference material. Microstructural changes after the temperature sweep tests were examined. Chip boundaries present in consolidated products were observed to suppress grain coarsening which otherwise was significant in reference material. The present work is significant from the viewpoint of recycling of machined chips and development of sustainable manufacturing processes.
机译：通过固态压缩冷压然后热挤压的循环利用技术，可以将商用级纯镁方坯车削而成的切屑进行固结。冷压坯料在四个不同的温度下进行挤压：250℃，300℃，350℃和400℃为了比较，在相似的条件下挤压了铸镁（纯）坯料。对挤出产品的阻尼特性进行了表征。在5 Hz的固定频率下，测量阻尼能力和动态模量随时间和温度的变化，与参考材料相比，在片状固结产品中观察到阻尼能力提高10％至14％。检查了温度扫描测试后的微观结构变化。观察到固结产品中存在的切屑边界可抑制晶粒粗化，否则晶粒粗化在参考材料中很明显。从回收加工芯片和开发可持续制造工艺的角度来看，当前的工作意义重大。

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