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首页> 外文期刊>Materials Science and Engineering >High-temperature shear strength of lead-free Sn-Sb-Ag/Al_2O_3 composite solder
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High-temperature shear strength of lead-free Sn-Sb-Ag/Al_2O_3 composite solder

机译：无铅Sn-Sb-Ag / Al_2O_3复合焊料的高温剪切强度

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摘要

The lead-free Sn-1.7Sb-1.5Ag solder alloy and the same material reinforced with 5 vol.% of 0.3-μm Al_2O_3 particles were synthesized using the powder-metallurgy route of blending, compaction, sintering, and extrusion. The mechanical properties of both monolithic and composite solders were studied by shear punch testing (SET) at temperatures in the range of 25-130℃ Depending on the test temperature, the shear yield stress (SYS) increased by 4.8-8.8 MPa, and ultimate shear strength (USS) increased by 6.2-8.8 MPa in the composite material. The strength improvement was mostly due to the CTE mismatch between the matrix and the particles, and to a lesser extent to the Orowan strengthening mechanism of the submicro-sized Al_2O_3 particles in the composite solder. The contribution of each of these mechanisms was used in a modified shear lag model to predict the total composite-strengthening achieved.
机译：采用混合，压实，烧结和挤压的粉末冶金工艺，合成了无铅Sn-1.7Sb-1.5Ag焊料合金和用5％（体积）的0.3μmAl_2O_3颗粒增强的相同材料。在25-130℃的温度范围内，通过剪切冲头测试（SET）研究了整体和复合焊料的机械性能。根据测试温度，剪切屈服应力（SYS）增加4.8-8.8 MPa，最终复合材料的抗剪强度（USS）提高了6.2-8.8 MPa。强度提高主要是由于基体和颗粒之间的CTE不匹配，而较小程度地归因于复合焊料中亚微米级Al_2O_3颗粒的Orowan增强机理。这些机制中的每一个的作用都用于改进的剪力滞后模型中，以预测所实现的总复合材料强度。

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