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首页> 外文期刊>Materials Science and Engineering >Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints
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Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints

机译：镧对Sn-3.5Ag焊点粘合强度和断裂行为的影响

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摘要

This study investigates the effects of trace amounts of La addition on the microstructure, adhesive strength and fracture behavior of Sn-3.5Ag solder joints. The electron backscatter diffraction (EBSD) results confirmed that the face-centered cubic (fcc) structure of LaSn_3 compounds distributed randomly in the P-Sn matrix had no obvious preferred orientation. La additions reduced the ripening reaction rate of the scallop-type Cu_6Sn_5 compounds at the interface layer. In spite of the significant refinement of microstructure and suppression of the growth of intermetallic Cu_6Sn_5 compounds caused by the La additions, the expected enhancement of adhesive strength and ductility did not occur apparently. With the aid of Argon Beam Milling, we have found defects and voids inside the LaSn_3 compounds; these features were closely related to the crack initiation and formation during the adhesive tensile test. Consequently, the beneficial effect due to the refinement of microstructure and suppression of interfacial layer compounds was retarded. In the aged samples, trace amounts of La addition suppressed the Sn diffusion and retarded the growth of the Cu_6Sn_5 layer, but not that of the Cu_3Sn layer.
机译：这项研究调查了微量La的添加对Sn-3.5Ag焊点的组织，粘合强度和断裂行为的影响。电子背散射衍射（EBSD）结果证实，随机分布在P-Sn基质中的LaSn_3化合物的面心立方（fcc）结构没有明显的优先取向。 La的添加降低了界面层扇贝型Cu_6Sn_5化合物的成熟反应速率。尽管通过添加La可以显着改善微观结构并抑制金属间化合物Cu_6Sn_5的生长，但并未明显实现预期的粘合强度和延展性提高。借助氩束铣削，我们发现了LaSn_3化合物内部的缺陷和空隙；这些特征与粘合剂拉伸试验中的裂纹萌生和形成密切相关。因此，由于微结构的细化和界面层化合物的抑制而产生的有益效果被延迟。在老化的样品中，微量的La添加抑制了Sn的扩散并阻碍了Cu_6Sn_5层的生长，但没有抑制Cu_3Sn层的生长。

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  • 来源
    《Materials Science and Engineering》 |2011年第11期|p.3630-3638|共9页
  • 作者

    Hwa-TengLee; Yin-FaChen; Alexander Schwedt; Joachim Mayer;

  • 作者单位

    Department of Mechanical Engineering, National Cheng-Kung University, No. 1, University Road, Tainan City 701, Taiwan, ROC;

    Department of Mechanical Engineering, National Cheng-Kung University, No. 1, University Road, Tainan City 701, Taiwan, ROC,Central Facility for Electron Microscopy, RWTH Aachen University, D-52074 Aachen, Germany;

    Central Facility for Electron Microscopy, RWTH Aachen University, D-52074 Aachen, Germany;

    Central Facility for Electron Microscopy, RWTH Aachen University, D-52074 Aachen, Germany;

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  • 正文语种 eng
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  • 关键词

    la addition; lasn_3; intermetallic compound (IMC); adhesive strength; fracture behavior;

    机译：la另外;lasn_3;金属间化合物（IMC）;粘合强度;断裂行为;

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