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Shock compression of monocrystalline copper: Experiments, characterization, and analysis

机译:单晶铜的冲击压缩:实验,表征和分析

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摘要

Monocrystalline copper samples with [001] and [221] orientations were subjected to shock/recovery experiments at 30 and 57 GPa and 90 K. The slip system activity and the microstructural evolution were investigated. Different defect structures, including dislocations, stacking faults, twins, microbands, and recrystallized grains were observed in the specimens. The residual microstructures were dependent on crystalline orientation and pressure. The differences with crystalline orientations are most likely due to different resolved shear stresses on specific crystalline planes. The geometric relationships between the shock propagation direction and crystalline orientation are presented under uniaxial strain. It is shown that the [221] orientation, by virtue of having fewer highly activated slip systems, exhibits greater concentration of deformation with more intense shear on the primary system. This, in turn leads to greater local temperature rise and full recrystallization, in spite of the thermodynamic residual temperature of ~500 K and rapid cooling (within 20 s) to ambient temperature. The profuse observation of microbands is interpreted in terms of the mechanism proposed by Huang and Gray [J.C. Huang, G.T. Gray III, Acta Metallurgica 37 (1989) 3335-3347].
机译:取向为[001]和[221]的单晶铜样品分别在30 GPa和57 GPa和90 K下进行了冲击/恢复实验。研究了滑移系统的活性和微观结构的演变。在样品中观察到不同的缺陷结构,包括位错,堆垛层错,孪晶,微带和重结晶晶粒。残余的微结构取决于晶体取向和压力。晶体取向的差异很可能是由于特定晶体平面上不同的解析剪切应力所致。在单轴应变下给出了冲击传播方向与晶体取向之间的几何关系。结果表明,[221]取向由于具有较少的高度活化的滑移系统,在初级系统上表现出更大的变形集中和更大的剪切力。尽管有约500 K的热力学残余温度和迅速冷却(在20 s之内)到环境温度,这又导致更大的局部温度升高和完全重结晶。根据Huang和Gray提出的机制解释了对微带的广泛观察[J.C.黄国泰Gray III,金属学报37(1989)3335-3347]。

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  • 来源
    《Materials Science and Engineering》 |2010年第3期|424-434|共11页
  • 作者单位

    Department of Mechanical Engineering, The Johns Hopkins University, Baltimore, MD 21218, United States;

    Lawrence Livermore National Laboratory, Livermore, CA 94550, United States;

    Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China;

    Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China;

    Departments of Mechanical and Aerospace Engineering and Nanoengineering, UC San Diego, La Jolla, San Diego, CA 92093, United States;

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  • 原文格式 PDF
  • 正文语种 eng
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  • 关键词

    shock compression; shock loading; slip bands; microtwins; microbands;

    机译:冲击压缩冲击载荷滑带;微双胞胎微带;

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