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Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation

机译：纳米茚满的Ag纳米粒子改性石墨烯/ Sn-Ag-Cu焊料的力学性能研究

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摘要

In this study, mechanical mixing and ball milling were used to mix a variety of different mass fractions of Ag nanoparticle-modified graphene nanosheets (Ag-GNSs) and Sn-Ag-Cu solder alloys to form composite solder alloys. We found that the latter was superior to the former, as the ball-milled samples showed better mechanical properties through nanoindentation tests. The mechanical properties of solder alloys reinforced with Ag-GNSs were compared with those reinforced with unmodified GNSs, and we found that Ag-GNSs were more beneficial for reinforcement. When the amount of Ag-GNSs increased, the composite solders showed improved Young's modulus, hardness, and creep resistance with the exception of 0.2 wt%. The indentation morphologies were observed by scanning electron microscope (SEM), while the microstructure of the composite solder alloys were analyzed by transmission electron microscope (TEM) and electron back scattering diffraction (EBSD). Due to grain boundary and dislocation strengthening, the mechanical properties of the composite solder alloys have been improved. A modified constitutive creep model considering microstructural strengthening showed great agreement with the experiment data.
机译：在该研究中，使用机械混合和球磨用于混合各种不同的Ag纳米颗粒改性石墨烯纳米片（Ag-GNSS）和Sn-Ag-Cu焊料合金以形成复合焊料合金。我们发现后者优于前者，因为球磨样的样品通过纳米狭窄试验显示出更好的机械性能。将用AG-GNSS增强的焊料合金的机械性能与用未改性的GNSS加强的那些进行比较，我们发现Ag-GNSS对增强更有利。当Ag-GNSS的量增加时，复合焊料显示出改善的杨氏模量，硬度和抗蠕变性，除了0.2wt％。通过扫描电子显微镜（SEM）观察压痕形态，而通过透射电子显微镜（TEM）和电子背散射衍射（EBSD）分析复合焊料合金的微观结构。由于晶界和脱位强化，复合焊料合金的机械性能已经提高。考虑微观结构强化的修改的本构蠕变模型表现出与实验数据的一致意见。

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  • 来源
    《Materials Science and Engineering》 |2019年第jul22期|138051.1-138051.13|共13页
  • 作者

    Han Y. D.; Gao Y.; Zhang S. T.; Jing H. Y.; Wei J.; Zhao L.; Xu L. Y.;

  • 作者单位

    Tianjin Univ Sch Mat Sci & Engn Tianjin 300350 Peoples R China|Tianjin Key Lab Adv Joining Technol Tianjin 300350 Peoples R China;

    Tianjin Univ Sch Mat Sci & Engn Tianjin 300350 Peoples R China|Tianjin Key Lab Adv Joining Technol Tianjin 300350 Peoples R China;

    Tianjin Univ Sch Mat Sci & Engn Tianjin 300350 Peoples R China|Tianjin Key Lab Adv Joining Technol Tianjin 300350 Peoples R China;

    Tianjin Univ Sch Mat Sci & Engn Tianjin 300350 Peoples R China|Tianjin Key Lab Adv Joining Technol Tianjin 300350 Peoples R China;

    Singapore Inst Mfg Technol 71 Nanyang Dr Singapore Singapore;

    Tianjin Univ Sch Mat Sci & Engn Tianjin 300350 Peoples R China|Tianjin Key Lab Adv Joining Technol Tianjin 300350 Peoples R China;

    Tianjin Univ Sch Mat Sci & Engn Tianjin 300350 Peoples R China|Tianjin Key Lab Adv Joining Technol Tianjin 300350 Peoples R China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Composite solders; Reinforcement; Ball milling method; Nanoindentation; Creep model;

    机译：复合焊料;加固;球铣​​削方法;纳米凸缘;蠕变模型;

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