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首页> 外文期刊>Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing >Microscopy and strength of borosilicate glass-to-Kovar alloy joints
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Microscopy and strength of borosilicate glass-to-Kovar alloy joints

机译：硼硅酸盐玻璃-科瓦合金接头的显微镜和强度

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The microstructural basis of the strength of borosilicate glass-to-Kovar alloy joints has been investigated where the alloy was preoxidised at 750 ℃ for l0min in air. X-ray diffraction revealed that the oxide scale consisted of hematite and magnetite. Glass was bonded to the alloy by melting at 1000 ℃ for 15min under two conditions: (a) ambient atmosphere and (b) vacuum (360mbar). Scanning and transmission electron microscopy revealed an iron oxide interlayer in the joint bonded under normal atmosphere. Dendritic fayalite nucleated on the iron oxide interlayer and grew into the glass. In the joint made under vacuum, neither the interlayer nor the fayalite phase was observed. In both cases, Co and Ni in the alloy were not involved in the chemical bonding. The joint formed under vacuum had a higher bonding strength of 4.3 MPa, compared to 3.6 MPa for the joint bonded under ambient atmosphere.
机译：研究了硼硅酸盐玻璃与科瓦合金接头的强度的微观结构基础，该合金在空气中于750℃预氧化10分钟。 X射线衍射表明，氧化皮由赤铁矿和磁铁矿组成。通过在以下两个条件下于1000℃熔化15分钟，将玻璃与合金结合：（a）环境气氛和（b）真空（360mbar）。扫描和透射电子显微镜显示在正常大气下结合的接头中存在氧化铁中间层。树枝状铁橄榄石在氧化铁中间层上成核并长成玻璃。在真空下制成的接头中，既未观察到中间层也未观察到铁橄榄石相。在两种情况下，合金中的Co和Ni都不参与化学键合。在真空下形成的接头具有较高的粘结强度，为4.3 MPa，而在环境气氛下粘结的接头为3.6 MPa。

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