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Joint strength of Inconel 718 alloy and its improvement by post-weld heat treatment - joint performance and its controlling factors in friction welding of Inconel 718 alloy

机译:Inconel 718合金的接头强度及其通过焊后热处理的改进-Inconel 718合金的摩擦焊接接头性能及其控制因素

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The influences of welding parameters on tensile properties of friction-welded joints of Inconel 718 alloy (subjected to a post-weld heat treatment (PWHT) consisting of a solution treatment at 1253 K and double ageing treatments at 993 and 893 K) have been investigated to reveal the controlling factor of the joint performance. All joints obtained were fractured near the bond interface at smaller elongations and area reductions than the base metal on tensile tests, although most of them showed tensile strengths comparable with that of the base metal. The observations of fractured surface and its cross-sectional microstructure suggested that an interfacial fine grain zone including numerous fine Laves phase particles 30-100 nm in size was responsible for a low ductility fracture at shorter friction time and lower friction pressure. As the friction time and pressure were increased, the fine grain zone disappeared, and a reduction in hardness near the bond interface became significant, causing a rather ductile fracture near the bond interface. With an increase in friction time, coarse Laves phase particles, a few micrometres in size remaining near the bond interface increased and they acted as a crack nucleation site of ductile fracture. An increase in the solution treatment temperature during the post-weld heat treatment enhanced the dissolution of the coarse Laves phase in the low-hardness region, and enabled us to obtain joints that were free from unacceptable grain growth and fractured in the base metal at a solution treatment temperature of 1323 K.
机译:研究了焊接参数对Inconel 718合金摩擦焊接接头拉伸性能的影响(该焊接后焊接热处理包括在1253 K下进行固溶处理以及在993和893 K下进行双时效处理)揭示关节性能的控制因素。尽管在拉伸试验中获得的所有接头大多数都表现出与母材相当的拉伸强度,但它们在结合界面附近的断裂伸长率和面积减小均小于母材。断裂表面及其横截面微观结构的观察表明,包括许多尺寸为30-100 nm的大量Laves相细颗粒的界面细晶粒区是在较短的摩擦时间和较低的摩擦压力下产生低延展性断裂的原因。随着摩擦时间和压力的增加,细晶粒区域消失,键合界面附近的硬度降低变得显着,从而在键合界面附近造成了相当大的延性断裂。随着摩擦时间的增加,粗糙的Laves相颗粒(在键界面附近保留的几微米大小)增加,它们充当韧性断裂的裂纹成核位点。焊后热处理过程中固溶处理温度的升高增强了低硬度区域中粗拉夫斯相的溶解,使我们能够获得无晶粒生长不合格且母材在20℃断裂的接头。固溶处理温度为1323K。

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