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Annealing behavior comparison of NTD FZ (H) Si irradiated in light-water-reactor and heavy-water-reactor

机译:轻水反应器和重水反应器辐照NTD FZ(H)Si的退火行为比较

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摘要

Electrical properties and defect annealing behavior of neutron transmutation doping Si (NTD Si) grown by floating-zone (FZ) method in a hydrogen (H) atmosphere were studied by resistivity measurements, optical microscopy and infrared (IR) absorption spectra. The NTD of the crystal silicon ingots was performed in a light-water-reactor [L NTD FZ (H) Si] and a heavy-water-reactor [H NTD FZ (H) Si] respectively. A comparison of annealing behaviors has been made between the L NTD FZ (H) Si and H NTD FZ (H) Si samples. After annealing at approx 480 deg C an excess donor concentration has been observed in both crystals. L NTD FZ (H) Si and H NTD FZ (H) Si. The values for the donor decomposition activation energy are about 1.5 and 0.4 eV in the annealing temperature ranges of 500-540, and 580-640 deg C, respectively. There is a peripheral lag during the conductivity conversion from p- to n-type in the L NTD FZ (H) Si but not in H NTD FZ (H) Si samples. Hydrogen-related defects (big pits) in H NTD FZ (H) Si samples and micro-defects in L NTD FZ (H) Si samples were observed by optical microscopy.
机译:通过电阻率测量,光学显微镜和红外(IR)吸收光谱研究了通过浮区(FZ)方法在氢(H)气氛中生长的中子trans杂掺杂硅(NTD Si)的电性能和缺陷退火行为。晶体硅锭的NTD分别在轻水反应器[L NTD FZ(H)Si]和重水反应器[H NTD FZ(H)Si]中进行。已对L NTD FZ(H)Si和H NTD FZ(H)Si样品之间的退火行为进行了比较。在约480摄氏度下退火后,在两个晶体中均观察到过量的供体浓度。 L NTD FZ(H)Si和H NTD FZ(H)Si。供体分解活化能的值在500-540和580-640℃的退火温度范围内分别为约1.5和0.4eV。在L NTD FZ(H)Si样品中,电导率从p型转换为n型时存在外围滞后,而在H NTD FZ(H)Si样品中则没有。通过光学显微镜观察了H NTD FZ(H)Si样品中与氢有关的缺陷(大凹坑)和L NTD FZ(H)Si样品中的微缺陷。

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