机译:高导热率和低介电损耗切线的金刚石复合材料
Institute for Superhard Materials National Academy of Sciences of Ukraine 2 Avtozavodskya St Kyiv 04074 Ukraine;
Lukasiewicz Research Network - Krakow Institute of Technology Zakopianska 73 Krakow 30-418 Poland;
AGH University of Science and Technology 30 al. A. Mickiewicza Krakow 30-059 Poland;
Institute for Superhard Materials National Academy of Sciences of Ukraine 2 Avtozavodskya St Kyiv 04074 Ukraine;
Institute for Superhard Materials National Academy of Sciences of Ukraine 2 Avtozavodskya St Kyiv 04074 Ukraine;
Lukasiewicz Research Network - Krakow Institute of Technology Zakopianska 73 Krakow 30-418 Poland;
Institute for Superhard Materials National Academy of Sciences of Ukraine 2 Avtozavodskya St Kyiv 04074 Ukraine;
AGH University of Science and Technology 30 al. A. Mickiewicza Krakow 30-059 Poland;
Diamond composite; High pressure; Thermal conductivity; Dielectric constant; Dielectric loss tangent;
机译:高性能六方氮化硼/双马来酰亚胺复合材料,具有高导热率,低热膨胀系数和低介电损耗
机译:具有增强的导热率和超低介电损耗的聚丙烯纳米复合材料硼氮化物纳米片的一步烷基改性
机译:核心壳结构的Al / PVDF纳米复合材料具有高介电常数,但损耗低,导热性增强
机译:高导热低损耗正切氮化铝陶瓷的研究
机译:用于热管理应用的块状电沉积金属-金刚石复合材料的导热系数
机译:通过非接触微波腔扰动测量的大型封装外延石墨烯的表面电导率和介电损耗正切值的保持
机译:高能量密度氰酸酯复合材料的制备及机理,通过用导电,电介质和绝缘层构建多层结构,通过建立多层结构的高能量密度氰酸酯复合材料
机译:低介电损耗切线用陶瓷基复合材料的纤维涂层离子辅助沉积