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Qualitative Simulation of the Growth of Electrolessly Deposited Cu Thin Films

机译:化学沉积铜薄膜生长的定性模拟

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摘要

Electroless deposition for fabricating copper (Cu) interconnects of integrated circuits has drawn attention due to its low processing temperature, high deposition selectivity, and high coverage. In this paper, three-dimensional computer simulations of the qualitative growth properties of Cu particles and two-dimensional simulations of the trench-filling properties are conducted. The mathematical model employed in the study is a reaction-diffusion equation. An implicit finite difference discretization with a red-black Gauss-Seidel method as a solver is proposed for solving the reaction-diffusion equation. The simulated deposition properties agree with those observed in experimentation. Alternatives to improve the deposition properties are also discussed.
机译:由于其低的处理温度,高的沉积选择性和高的覆盖率,用于制造集成电路的铜(Cu)互连的化学沉积引起了人们的关注。在本文中,对铜粒子的定性生长特性进行了三维计算机模拟,并对沟槽填充特性进行了二维模拟。该研究中使用的数学模型是反应扩散方程。为了解决反应扩散方程,提出了一种以红黑高斯-赛德尔法为求解器的隐式有限差分离散化方法。模拟的沉积特性与实验观察到的一致。还讨论了改善沉积性能的替代方法。

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  • 来源
    《Mathematical Problems in Engineering》 |2011年第2期|p.1-13|共13页
  • 作者

    Hsiu-Chuan Wei;

  • 作者单位

    Department of Applied Mathematics, Feng Chia University, Seatwen, Taichung 40724, Taiwan;

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  • 正文语种 eng
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