Settling of Copper Drops in Molten Slags

A. WARCZOK; T.A. UTIGARD

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Settling of Copper Drops in Molten Slags

机译：熔渣中铜滴的沉降

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The settling of suspended metal and sulfide droplets in liquid metallurgical slags can be affected by electric fields. The migration of droplets due to electrocapillary motion phenomena may be used to enhance the recovery of suspended matte/metal droplets and thereby to increase the recovery of pay metals. An experimental technique was developed for the purpose of measuring the effect of electric fields on the settling rate of metallic drops in liquid slags. Copper drops suspended in CaO-SiO_2-Al_2O_3-Cu_2O slags were found to migrate toward the cathode. Electric fields can increase the settling rate of 5-mm-diameter copper drops 3 times or decrease the settling until levitation by reversal of the electric field. The enhanced settling due to electric fields decreases with increasing Cu_2O contents in the slag.

机译：液态冶金渣中悬浮的金属和硫化物液滴的沉降会受到电场的影响。由于电毛细管运动现象而引起的液滴的迁移可用于增强悬浮的无光泽/金属液滴的回收率，从而增加重金属的回收率。为了测量电场对液态渣中金属滴沉降速率的影响，开发了一种实验技术。发现悬浮在CaO-SiO_2-Al_2O_3-Cu_2O炉渣中的铜滴向阴极迁移。电场可以使直径为5毫米的铜滴的沉降速度提高3倍，或者降低沉降直至因电场反转而悬浮。随着电场的增加，沉降量随炉渣中Cu_2O含量的增加而降低。

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《Metallurgical and Materials Transactions》 |1995年第6期|p.1165-1173|共9页
作者
A. WARCZOK; T.A. UTIGARD;
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Department of Metallurgy and Materials Science, University of Toronto, Toronto, ON, Canada M5S 1A4;

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正文语种 eng
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Settling of Copper Drops in Molten Slags

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