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Using an E-beam method and line monitoring to perform in-line inspection

机译：使用电子束方法和生产线监控进行生产线检查

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The complexity of advanced wafer processes has increased the risk of unique defects such as buried electrical defects and optically transparent residues. Using its existing inspection toolset, Altis Semiconductor (an IBM-Infineon joint venture in Corbeil- Essonnes, France) was unable to detect such defects before final test, risking yield losses. To support its yield-ramp and yield-monitoring strategies, the company turned to E-beam inspection (EBI). With its unique voltage contrast inspection capability, EBI can ensure that critical (killer) defects are detected before the end of line, resulting in con- siderable cost savings and increasing learning cycles during technology ramps. Altis installed its first EBI tool, an eS20XP from KLA-Tencor (San Jose), in April 2001. The system was used in engineering analysis and line-monitoring applications to monitor production lots in-line, enabling the company to react more effectively to process changes and defect excursions.
机译：先进晶圆工艺的复杂性增加了独特缺陷（如掩埋的电气缺陷和光学透明残留物）的风险。使用其现有的检查工具集，Altis Semiconductor（位于法国Corbeil-Essonnes的IBM-Infineon合资企业）无法在最终测试之前检测到此类缺陷，从而冒着良率损失的风险。为了支持其产量上升和产量监测策略，该公司转向电子束检查（EBI）。通过其独特的电压对比检查功能，EBI可以确保在生产线结束之前检测到关键（致命）缺陷，从而节省了可观的成本，并在技术升级期间增加了学习周期。 Altis于2001年4月安装了其第一个EBI工具，即来自KLA-Tencor（圣何塞）的eS20XP。该系统用于工程分析和生产线监控应用程序，以在线监控生产批次，从而使公司能够更有效地应对工艺变更和缺陷偏移。

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