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首页> 外文期刊>Journal of Microelectromechanical Systems >Vertical Thermopiles Embedded in a Polyimide-Based Flexible Printed Circuit Board
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Vertical Thermopiles Embedded in a Polyimide-Based Flexible Printed Circuit Board

机译：垂直热电堆嵌入基于聚酰亚胺的柔性印刷电路板中

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摘要

A fabrication process for vertical thermopiles embedded in a 75-$mu hbox{m}$-thick polyimide foil has been developed for flexible printed circuit boards (flex PCBs). The vertical connections consist of electrodeposited antimony- and nickel-plated through-hole vias. The plated through-hole vias consist of multiple wires, with a total metal content that is 1% of the total via volume. The via fabrication technique is similar to standard flex PCB wet etch and metallization processes. The main difference is that the foils are pretreated with ion irradiation to induce highly selective vertical etch rates. The thermopiles were characterized by measuring their voltage response to an applied temperature difference across the foil thickness.$hfill$[2007-0133]
机译：已经开发出用于柔性印刷电路板（flex PCBs）的，嵌入在75-μmuhbox {m} $厚的聚酰亚胺箔中的垂直热电堆的制造工艺。垂直连接由电沉积的锑和镍镀通孔组成。镀通孔由多根导线组成，金属总含量为总通孔体积的1％。通孔制造技术类似于标准的柔性PCB湿法蚀刻和金属化工艺。主要区别在于箔经过离子辐照预处理以诱导高度选择性的垂直蚀刻速率。通过测量热电堆对整个箔厚度上施加的温差的电压响应来表征热电堆。$ hfill $ [2007-0133]

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