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Optical characterizations and reverse-bias electroluminescence observation for reliability investigations of the InGaN light emitting diode

机译:用于InGaN发光二极管可靠性研究的光学特性和反向偏置电致发光观察

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摘要

The reverse-bias operation of the InGaN light-emitting diode (LED) device can reveal device-reliability problems. This study uses optical characterization techniques, including surface temperature measurements, two-dimensional (2D) X-ray fluorescent (XRF) element analysis, 2D electroluminescence (EL) images processed by Matlab, and electrical measurements to visualize the current leakages around the metal contact of the device. Connections between the device performance and the reverse-bias EL current distribution have been established. This paper attributes the origin of the reverse-bias emission to a high electric field caused by weak structures during process variations. Hot electron-induced emissions due to a leakage current may be a mechanism of the reverse-bias emission. Furthermore, reverse-bias stress on the devices is performed on the LED devices to investigate reliability issues. The reverse-bias light emission is relevant to reliability problems because of its combination of optical characterization and electrical performance. These techniques provide a screening tool that will correlate device failures with the fabrication process for future industrial applications.
机译:InGaN发光二极管(LED)器件的反向偏置操作可以揭示器件可靠性问题。这项研究使用光学表征技术,包括表面温度测量,二维(2D)X射线荧光(XRF)元素分析,Matlab处理的2D电致发光(EL)图像以及电学测量,以可视化金属触点周围的电流泄漏设备的已经建立了器件性能与反向偏置EL电流分布之间的联系。本文将反向偏置发射的起因归因于工艺变化过程中结构薄弱导致的高电场。由于漏电流引起的热电子感应发射可能是反向偏置发射的机制。此外,在LED器件上执行器件上的反向偏置应力以调查可靠性问题。反向偏置光发射由于其光学特性和电气性能的结合而与可靠性问题有关。这些技术提供了一种筛选工具,可以将设备故障与制造工艺相关联,以用于未来的工业应用。

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