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UV enhanced substrate conformal imprint lithography (UV-SCIL) technique for photonic crystals patterning in LED manufacturing

机译：UV增强基板保形压印光刻（UV-SCIL）技术用于LED制造中的光子晶体图案化

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The global LED (light emitting diode) market reached 5 billion dollors in 2008 and will be driven towards 9 billion dollors by 2011 [1]. The current applications are dominated by portable device backlighting, e.g. cell phones, PDAs, GPS, laptop etc. In order to open the general lighting market doors the luminous efficiency needs to be improved significantly. Photonic crystal (PhC) structures in LEDs have been demonstrated to enhance light extraction efficiency on the wafer level by researchers [2]. However, there is still a great challenge to fabricate PhC structures on LED wafers cost-effectively. Nanoimprint lithography (NIL) [3] has attracted considerable attentions in this field due to its high resolution, high throughput and low cost of ownership (CoO). However, the current NIL techniques with rigid stamps rely strongly on the substrate flatness and the production atmosphere. Those factors hinder the integration of NIL into high volume production lines. UV-NIL with flexible stamps [4], e.g. PDMS stamps, allows the large-area imprint in a single step and is less-sensitive to the production atmosphere. However, the resolution is normally limited due to stamp distortion caused by imprint pressure.rnA novel NIL technique developed by Philips Research and Suss MicroTec, substrate conformal imprint lithography (SCIL), bridges the gap between UV-NIL with rigid stamp for best resolution and soft stamp for large-area patterning. Based on a cost-effective upgrade on Suess mask aligner, the capability can be enhanced to nanoimprint with resolution of down to sub-10 nm on an up to 6 inch area without affecting the established conventional optical lithographic processes on the machine. Benefit from the exposure unit on the mask aligners, the SCIL process is now extended with UV-curing option, which can help to improve the throughput dramatically. In this paper, the fabrication of photonic crystal structures with SCIL technique on Suess MA6 mask aligner is demonstrated. In addition, the industrialization considerations of UV-SCIL process in high volume manufacturing are briefly discussed.
机译：2008年，全球LED（发光二极管）市场达到50亿美元，到2011年将达到90亿美元[1]。当前的应用以便携式设备的背光为主导，例如。为了打开通用照明市场的大门，发光效率需要大大提高。研究人员已证明，LED中的光子晶体（PhC）结构可提高晶片级的光提取效率[2]。然而，以成本有效的方式在LED晶圆上制造PhC结构仍然是一个巨大的挑战。纳米压印光刻技术（NIL）[3]由于其高分辨率，高产量和低拥有成本（CoO）而备受关注。但是，当前的带有刚性压模的NIL技术在很大程度上取决于基板的平坦度和生产环境。这些因素阻碍了NIL进入大批量生产线的整合。带柔性印章的UV-NIL [4]，例如PDMS印章可以在一个步骤中完成大面积的印记，并且对生产环境不那么敏感。但是，分辨率通常会因压印压力引起的印章变形而受到限制。rn飞利浦研究公司和Suss MicroTec共同开发的一种新型NIL技术，即基板保形压印光刻（SCIL），弥合了UV-NIL与刚性印章之间的差距，以获得最佳分辨率和用于大面积构图的软图章。基于Suess掩模对准器的经济高效升级，可以在不影响机器上已建立的常规光学光刻工艺的情况下，在高达6英寸的区域上将分辨率降至10纳米以下的纳米压印技术进行增强。得益于掩模对准器上的曝光单元，SCIL工艺现已扩展为具有UV固化选项，这可以帮助显着提高生产率。本文介绍了在Suess MA6掩模对准器上采用SCIL技术制造光子晶体结构的过程。另外，简要讨论了UV-SCIL工艺在大批量生产中的工业化考虑。

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