...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Microelectronic Engineering >Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development
【24h】

Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development

机译：共晶Sn-3.5Ag焊料中Co的添加对剪切强度和微结构发展的影响

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

In this study, the approach of composite solder using eutectic Sn-3.5Ag solder and Co was tried. Co particles and Sn-3.5Ag solder paste were mechanically mixed at Co weight fractions from 0.1% to 2.0%. For the Co-mixed Sn-3.5Ag solder pastes, their melting temperatures and spreading areas were measured. The solder pastes were stencil printed on test substrates and reflowed to form solder bumps. Ball shear test was performed to examine shear strength of Co-reinforced Sn-3.5Ag solder bumps. As a result, Co addition up to 2 wt.% did not alter the melting temperature under heating but reduced undercooling. The maximum shear strength of Co-reinforced Sn-3.5Ag solder bumps increased by 28% compared to normal ones. The increase in shear strength can be attributed to the (Cu,Co)_3Sn_2 intermetallic compounds.
机译：在这项研究中，尝试了使用共晶Sn-3.5Ag焊料和Co的复合焊料的方法。将Co颗粒和Sn-3.5Ag焊膏以Co重量分数从0.1％到2.0％机械混合。对于共混合的Sn-3.5Ag锡膏，测量了它们的熔化温度和铺展区域。将锡膏模版印刷在测试基板上，然后回流以形成锡球。进行球剪切测试以检查Co增强的Sn-3.5Ag焊料凸块的剪切强度。结果，最多2wt。％的Co添加没有改变加热时的熔融温度，但是降低了过冷。与普通焊料相比，钴增强的Sn-3.5Ag焊料凸块的最大剪切强度提高了28％。剪切强度的增加可归因于（Cu，Co）_3Sn_2金属间化合物。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号