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Nanocomposite resist systems for next generation lithography

机译:用于下一代光刻的纳米复合抗蚀剂系统

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摘要

A novel nanocomposite resist system was developed for sub-100 nm resolution e-beam lithography by dispersing surface-treated silica nanoparticles in a commercial ZEP520 resist. At 4.0 wt./100 loading of silica nanoparticles, the system exhibited a much higher resolution than ZEP520 without sacrificing the intrinsic sensitivity and contrast of the starting polymer. The first major result is that 46 nm-wide isolated lines were obtained in the nanocomposite system (~250 nm-thick layer), whereas comparatively 130 nm-wide lines were obtained in ZEP520 under the same experimental conditions.
机译:通过将表面处理的二氧化硅纳米粒子分散在商用ZEP520光刻胶中,开发了一种用于100纳米以下分辨率电子束光刻的新型纳米复合光刻胶系统。当二氧化硅纳米粒子的负载量为4.0 wt./100时,该系统显示出比ZEP520高得多的分辨率,而不会牺牲起始聚合物的固有灵敏度和对比度。第一个主要结果是在相同的实验条件下,在纳米复合材料系统(约250 nm厚的层)中获得了46 nm宽的分离线,而在ZEP520中获得了130 nm宽的分离线。

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