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首页> 外文期刊>Microelectronics journal >Stress and resistivity analysis of electrodeposited gold films for MEMS application
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Stress and resistivity analysis of electrodeposited gold films for MEMS application

机译：MEMS应用电沉积金膜的应力和电阻率分析

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摘要

Electroplated gold films have attracted much attention in recent years because of its desirable properties for microsystems applications such as resistance to oxidation, low electrical resistance, overall chemical inertness and low processing temperature. In order to use gold in microelectromechanical systems designs, systematic tests has to be conducted to characterize the material in terms of its electrical as well as mechanical properties. In this paper, the stress and resistivity behavior of a nanometer-scale gold film with respect to the deposition parameters and annealing condition is reported.
机译：近年来，电镀金膜由于其在微系统应用中所需的特性而受到了广泛的关注，例如抗氧化性，低电阻，总体化学惰性和较低的加工温度。为了在微机电系统设计中使用金，必须进行系统的测试以从材料的电气和机械性能方面对材料进行表征。本文报道了纳米金膜相对于沉积参数和退火条件的应力和电阻率行为。

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