Advanpes in mesoscale thermal management technologies for microelectronics

Suresh V. Garimella

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Advanpes in mesoscale thermal management technologies for microelectronics

机译：微电子中尺度热管理技术的发展

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This paper presents recent advances in a number of novel, high-performance cooling techniques for emerging electronics applications. Critical enabling thermal management technologies covered include microchannel transport and micropumps, jet impingement, miniature flat heat pipes, transient phase change energy storage systems, piezoelectric fans, and prediction of interface contact conductance.

机译：本文介绍了针对新兴电子应用的许多新型高性能冷却技术的最新进展。涵盖的关键使能热管理技术包括微通道传输和微泵，射流冲击，微型扁平热管，瞬态相变储能系统，压电风扇以及界面接触电导的预测。

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来源
《Microelectronics journal》 |2006年第11期|p.1165-1185|共21页
作者
Suresh V. Garimella;
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作者单位

Cooling Technologies Research Center, School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47907-2088 USA;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;
关键词
mesoscale; thermal management; microelctronics;

机译：中尺度;热管理;微电子学;

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8. Scientific Research Program for Power, Energy, and Thermal Technologies. Task Order 0001: Energy, Power, and Thermal Technologies and Processes Experimental Research. Subtask: Thermal Management of Electromechanical Actuation System for Aircraft Primary Flight Control Surfaces. [R] . Lammers, Z. A. 2014

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Advanpes in mesoscale thermal management technologies for microelectronics

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