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首页> 外文期刊>Microelectronics reliability >Analysis of the viscoplastic behavior of Pb-free solder using lap shear joints
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Analysis of the viscoplastic behavior of Pb-free solder using lap shear joints

机译：使用LAP剪切接头的无铅焊料粘塑性行为分析

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The single lap shear tests were conducted on the most popular lead free solder alloy at two different shear strain rates ((gamma)over dot =0.01 s(-1) and 0.00001 s(-1)) in combination with three different temperatures (T = 25 degrees C, 75 degrees C, and 125 degrees C) to determine the viscoplastic model parameters utilizing the shear stress-strain data. The yielding of shear stress-strain curves was predicted and a unified viscoplastic model was proposed to calculate the entire shear stress-strain curves using material parameters and shear modulus. The shear stress-strain curves, which were obtained through lap shear tests and calculated by the model, show a very good relationship. Moreover, a finite element model, which was developed to create a lap shear simulation, calculates the shear stress-strain curves that make a reasonable agreement with the experimental data too. Plastic work/volume for monotonic lap shear and hysteresis curves for cyclic lap shear that are important parameters for predicting crack initiation and propagation of solder joint were calculated using a finite element model. As predicted, the variation of plastic works and hysteresis curves were observed due to strain rate and temperature changes. A thermal cycling simulation, which was created by utilizing the finite element model of lap shear specimen, demonstrates accumulation of plastic work occurred during ramping step rather than dwelling step.
机译：在两种不同的剪切应变速率（（γ）上，在与三种不同的温度（T）组合（T）（T.）以两种不同的剪切应变速率（（γ）和0.00001秒（-1））进行单圈剪切试验。 = 25摄氏度，75摄氏度和125摄氏度，以确定利用剪切应力 - 应变数据的粘液模型参数。预测剪切应力 - 应变曲线的屈服率，并且提出了一种统一的粘性模型，用于使用材料参数和剪切模量计算整个剪切应力 - 应变曲线。通过LAP剪切测试获得并通过模型计算的剪切应力 - 应变曲线显示出非常良好的关系。此外，开发的有限元模型以创建LAP剪切模拟，计算剪切应力 - 应变曲线，该曲线也与实验数据合理。使用有限元模型计算是用于预测裂纹启动和焊接接头传播的重要参数的单调圈剪切和滞后曲线的塑料工作/体积。如预测所示，由于应变速率和温度变化，观察到塑料工作和滞后曲线的变化。通过利用LAP剪切样品的有限元模型而产生的热循环模拟，证明了在斜坡上的塑料工作的积累而不是居住步骤。

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