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Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing

机译：Sn-Ag基焊料互连在热循环和剪切测试过程中的不均匀变形和微观结构演变

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摘要

Orientation imaging microscopy was adopted to characterize the microstructural changes in Sn-Ag-based solder interconnects during thermal cycling and shear testing. The deformation and microstructure evolution of Sn-Ag-based solder interconnects are inhomogeneous, depending on the orientations of p-Sn grains in the as-solidified microstructure. Recovery or recrystallization can take place even under pure shear stress at room temperature, and it tends to occur at high-angle grain boundaries in multi-grained solder interconnects, while it localizes in near-interface region in solder interconnects with only one grain inside. During thermal cycling, the hardness of recrystallized microstructure decreased significantly due to the segregation of Ag_3Sn IMC particles towards the newly-formed recrystallized boundaries, increasing the ease of localized deformation in this weakened microstructure. As a consequence, cracks were propagated intergranularly in the recrystallized microstructure.
机译：取向成像显微镜被用来表征在热循环和剪切测试过程中基于Sn-Ag的焊料互连的微观结构变化。 Sn-Ag基焊料互连的变形和微观结构演变是不均匀的，具体取决于刚凝固的微观结构中p-Sn晶粒的取向。甚至在室温下即使在纯剪切应力下也可能发生恢复或再结晶，并且它倾向于在多晶粒焊料互连中的高角度晶粒边界处发生，而它却定位在焊料互连中的近界面区域，内部只有一个晶粒。在热循环过程中，由于Ag_3Sn IMC颗粒向新形成的再结晶边界偏析，导致再结晶组织的硬度显着降低，从而增加了在这种弱化的组织中局部变形的难度。结果，裂纹在再结晶的微观结构中沿晶间扩展。

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  • 来源
    《Microelectronics reliability》 |2012年第6期|p.1112-1120|共9页
  • 作者

    Hongtao Chen; Jing Han; Jue Li; Mingyu Li;

  • 作者单位

    Department of Materials Science and Engineering, Shenzhen Graduate School, Harbin Institute of Technology, 518055 Shenzhen, China,State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, 150001 Harbin, China;

    Department of Materials Science and Engineering, Shenzhen Graduate School, Harbin Institute of Technology, 518055 Shenzhen, China;

    Department of Electronics, Aalto University School of Science and Technology, FIN-00076 Aalto, Finland;

    Department of Materials Science and Engineering, Shenzhen Graduate School, Harbin Institute of Technology, 518055 Shenzhen, China,State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, 150001 Harbin, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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