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On thermo-mechanical reliability of plated-through-hole (PTH)

机译：镀通孔（PTH）的热机械可靠性

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摘要

The mechanical properties of plated copper in plated-through-hole (PTH) were investigated experimentally by a thermo-mechanical analyzer, a nano-indenter, and an acoustic emission instrument. Coefficients of fatigue life prediction models for plated copper have been determined by different failure criteria. Afterwards thermal fatigue test of PTH at three different diameters were performed, and Weibull statistics was employed to evaluate the fatigue life of samples under different failure criteria. Finally, the strain variation of PTH during thermal cycle has been simulated by the finite element analysis (FEA) so as to predict its fatigue life by the selected models. From the comparison of the estimated fatigue life and its experimental results, it is found that the error can be minimized to be within 100%, provided that the drifting of electrical resistance by 20% is used as failure criteria and total strain amplitude is used as control variable in fatigue life prediction model. Based on these findings, design of PTH in printed circuit board (PCB) can be optimized by FEA. It is concluded that fatigue life of PTH will increase with lesser PCB layers, smaller depth-to-diameter ratio, higher PTH density and thicker plated copper.
机译：利用热机械分析仪，纳米压头和声发射仪对镀通孔（PTH）中镀铜的机械性能进行了实验研究。镀铜的疲劳寿命预测模型的系数已通过不同的失效标准确定。然后进行了三种不同直径的PTH的热疲劳试验，并采用Weibull统计方法评估了在不同破坏准则下样品的疲劳寿命。最后，通过有限元分析（FEA）对PTH在热循环过程中的应变变化进行了模拟，以便通过所选模型预测其疲劳寿命。从估算的疲劳寿命与其实验结果的比较中可以发现，只要将电阻的漂移量设为20％作为故障准则，并将总应变幅值用作最大误差，则误差可以最小化到100％以内。寿命预测模型中的控制变量。基于这些发现，FEA可以优化印刷电路板（PCB）中的PTH设计。结论是，PTH的疲劳寿命将随着PCB层的减少，深度与直径之比的减小，PTH密度的增加以及镀铜厚度的增加而延长。

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  • 来源
    《Microelectronics reliability》 |2012年第6期|p.1189-1196|共8页
  • 作者

    Fei Su; Ronghai Mao; Ji Xiong; Kun Zhou; Zheng Zhang; Jiang Shao; Cunyi Xie;

  • 作者单位

    School of Aeronautics Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100191, PR China;

    ALSTOM (Switzerland) Ltd., Brown Boveri Strasse 7, 5401 Baden, Switzerland;

    School of Aeronautics Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100191, PR China;

    School of Mechanical & Aeronautical Engineering, Nanyang Technological University. Singapore;

    School of Aeronautics Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100191, PR China;

    China Aero-Polytechnology Establishment, Beijing, China;

    Agilent Technologies (China) Co. Ltd.. China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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