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首页> 外文期刊>Microelectronics & Reliability >Interfacial reliability between hot-melt polyamides resin and textile for wearable electronics application
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Interfacial reliability between hot-melt polyamides resin and textile for wearable electronics application

机译：用于可穿戴电子设备的热熔聚酰胺树脂和纺织品之间的界面可靠性

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摘要

The interfacial reliability between hot-melt polyamides resin and textile is studied to investigate whether hot-melt polyamides resin is useful as an encapsulation material of wearable electronic devices. Four kinds of hot-melt polyamides resins and six kinds of textile fabrics are used, and the test sample is fabricated by molding polyamides resin on top of textile. To confirm the mechanical reliability between polyamides resin and textile under water washing and dry cleaning condition, the adhesion strength is measured by 90° peel test not only at initial state but also after exposing the sample to moisture and heat. As a result, it can be seen after high temperature and humidity test that peel strength is degraded and fracture mode can be changed from adhesive failure to cohesive failure according to textile fabric. Also, the optimal combination of polyamides resin and textile for better peel strength is obtained.
机译：研究了热熔聚酰胺树脂和纺织品之间的界面可靠性，以研究热熔聚酰胺树脂是否可用作可穿戴电子设备的封装材料。使用四种热熔聚酰胺树脂和六种织物，通过将聚酰胺树脂模制在织物上来制备测试样品。为了确认聚酰胺树脂和纺织品在水洗和干洗条件下的机械可靠性，不仅在初始状态下，而且在将样品暴露于湿气和热后，均通过90°剥离试验测量其粘合强度。结果，在高温和高湿试验后，可以看出，根据织物，剥离强度降低并且断裂模式可以从粘合破坏变为内聚破坏。而且，获得了聚酰胺树脂和纺织品的最佳组合以具有更好的剥离强度。

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  • 来源
    《Microelectronics & Reliability》 |2012年第7期|p.1501-1510|共10页
  • 作者

    Soon-Wan Chung; Hyun-Tae Kim;

  • 作者单位

    Mechatronics & Manufacturing Technology Center, Samsung Electronics, Co., Ltd., 416, Maetan-3Dong, Yeongtong-Gu, Suwon-City, Gyeonggi-Do 443-742, Republic of Korea;

    Mechatronics & Manufacturing Technology Center, Samsung Electronics, Co., Ltd., 416, Maetan-3Dong, Yeongtong-Gu, Suwon-City, Gyeonggi-Do 443-742, Republic of Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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