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Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests

机译:在高加速应力测试过程中模塑料的降解-一种通过进行纽扣剪切测试来研究粘合力的简单方法

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摘要

High temperature storage can degrade moulding compounds for chip encapsulation to such an extent that the adhesion to surfaces like copper (lead frames) or polyimide (chip coating) decreases drastically causing delamination. Also during normal operation of electronic components heat is generated locally (bond wire or chip surface) degrading the moulding compound and reducing the adhesion which in extreme cases can destroy the metallisation or the bond wires.
机译:高温存储会使芯片封装用的模塑料退化到一定程度,使得与铜(引线框架)或聚酰亚胺(芯片涂层)等表面的粘附力急剧下降,从而导致分层。同样,在电子元件的正常运行期间,局部(键合线或芯片表面)会产生热量,从而使模塑料降解并降低附着力,在极端情况下会破坏金属化或键合线。

著录项

  • 来源
    《Microelectronics & Reliability》 |2012年第7期|p.1266-1271|共6页
  • 作者单位

    Infineon Technologies AC, Am Campeon 1-12, 85579 Neubiberg, Germany;

    Infineon Technologies AC, Am Campeon 1-12, 85579 Neubiberg, Germany;

    Infineon Technologies AC, Am Campeon 1-12, 85579 Neubiberg, Germany;

    Infineon Technologies AC, Am Campeon 1-12, 85579 Neubiberg, Germany;

    Fraunhofer IZM Berlin, Germany;

    Fraunhofer IZM Berlin, Germany;

    Fraunhofer ENAS Chemnitz, Germany;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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