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Test methodology for durability estimation of surface mount interconnects under drop testing conditions

机译：在跌落测试条件下评估表面贴装互连的耐久性的测试方法

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摘要

This paper presents a generic methodology to determine the durability of surface mount interconnects in electronic assemblies, under drop loading conditions. Damage accumulated in the interconnects due to repeated drops is quantified in terms of local Printed Wiring Assembly (PWA) response (flexural strain, strain rate, acceleration, number of flexural cycles), rather than the loading (total impact energy, orientation and number of drops). The advantage is that the results are more generic and can be extrapolated to different assemblies and different loading/orientation conditions. A damage estimation model, based on the observed failure mechanism and mode, is used to determine the durability of the surface mount interconnects under the applied loading history. The same model can be used to extrapolate the results to field conditions. A case study, using a simple specimen, is presented to demonstrate the proposed methodology. Failures are observed in the interfacial intermetallic layer of the component bond pad in the corner solder joint. The generality of the method is demonstrated by calibrating the model constants with in-plane drop tests and then successfully predicting the durability for an out-of-plane drop test. Thus, the approach and model constants are shown to be independent of impact orientation and boundary conditions.
机译：本文提出了一种通用的方法来确定在跌落载荷条件下电子组件中表面安装互连的耐用性。由于重复掉落而在互连中累积的损坏可以通过局部印刷线路组件（PWA）响应（弯曲应变，应变率，加速度，弯曲循环数）来量化，而不是负载（总冲击能，取向和弯曲次数）来量化。滴）。优点是结果更通用，可以推断到不同的组件和不同的加载/方向条件。基于观察到的失效机制和模式的损伤估计模型用于确定在施加的载荷历史下的表面安装互连的耐久性。可以使用相同的模型将结果外推到现场条件。提出了一个使用简单标本的案例研究，以证明所提出的方法。在角焊点中的组件焊盘的金属间界面层中观察到了故障。通过使用面内跌落测试校准模型常数，然后成功预测面外跌落测试的耐久性，证明了该方法的普遍性。因此，方法和模型常数显示为独立于冲击方向和边界条件。

著录项

  • 来源
    《Microelectronics & Reliability》 |2007年第1期|p.93-103|共11页
  • 作者

    J. Varghese; A. Dasgupta;

  • 作者单位

    CALCE Electronic Packaging and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD 20740, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 一般性问题;
  • 关键词

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