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首页> 外文期刊>Microelectronics & Reliability >Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages
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Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages

机译：芯片数量对用于引线键合堆叠式芯片球栅阵列封装的焊球可靠性的影响

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This investigation examines how the number of chips affects the reliability of solder balls for wire-bonded stacked-chip ball grid array packages under thermal cycling tests. The studied objects were packages with one, two, three and four stacked chips. Three-dimensional finite element analysis was utilized to simulate the stress/strain behavior of all studied packages. Two kinds of properties of 63Sn/37Pb eutectic solder were employed individually in the finite element analyses. One property of the solder was assumed to exhibit the elastic-plastic-creep behavior. Temperature-dependent stress/strain curves and Norton's steady creep equation were used in the analysis. Another property of the solder governed by the Anand's viscoplastic model was also employed to describe the behavior of solder balls. The simulation results in the elastic-plastic-creep analyses and viscoplastic analyses reveal that the von Mises stress, the non-linear strain, and the inelastic strain energy density of the critical solder balls increase with the number of stacked chips, but the increments become gradually stable as the number of chips increases. Three fatigue life prediction models-Dar-veaux's model, the modified Coffin-Manson model and the creep-fatigue model-were applied to evaluate the fatigue life of the studied packages. Prediction results indicate that the fatigue life of the solder balls decreases as the number of stacked chips increases, and the decrease in predicted life shows stable behavior as the number of chips increases. The stable trend is consistent with experimental observation in the thermal cycling tests. By comparing with the experimental data, it is shown that the Darveaux's model gives better prediction than the other two models.
机译：这项研究调查了芯片数量如何影响在热循环测试中用于引线键合堆叠式芯片球栅阵列封装的焊球可靠性。被研究的对象是具有一，二，三和四个堆叠芯片的包装。三维有限元分析被用来模拟所有研究包装的应力/应变行为。有限元分析中分别采用了63Sn / 37Pb共晶焊料的两种性能。假定焊料的一种特性表现出弹塑性蠕变行为。分析中使用了温度相关的应力/应变曲线和诺顿稳态蠕变方程。由Anand的粘塑性模型控制的焊料的另一种特性也被用来描述焊料球的行为。弹塑性蠕变分析和粘塑性分析的仿真结果表明，关键焊球的冯·米塞斯应力，非线性应变和非弹性应变能密度随堆叠芯片的数量而增加，但随着增加而增加随着芯片数量的增加逐渐稳定。三种疲劳寿命预测模型-Dar-veaux模型，改进的Coffin-Manson模型和蠕变疲劳模型-用于评估研究包装的疲劳寿命。预测结果表明，随着堆叠切屑数量的增加，焊球的疲劳寿命降低，而随着切屑数量的增加，预测寿命的降低表现出稳定的行为。稳定趋势与热循环测试中的实验观察结果一致。通过与实验数据的比较，可以看出，与其他两个模型相比，Darveaux模型的预测效果更好。

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