The joke is that some COTS electronics go obsolete with the changing Christmas buying seasons, making it very difficult for mil programs to stock some surface-mount technology ICs over a 10-year period. However, Interconnect Systems Inc. is aiming to thwart the obsolescence Grinch via their footprint-conversion-enabling FlexFrame adapters. FlexFrame is designed to replace oft-obsolete j-lead and SMT gullwing IC packages such as PLCCs, QFPs, SOICs, and TSOPs.rnCalled "FlexFrame" because of its flexible configuration, the adapter includes several standoff heights, "unique" pitch and pin location, and carrier windows allowing center-of-interconnect component placement. The high availability FlexFrame design accomplishes its mission via PhosBronze pins tucked inside an FR4 carrier, then shaped to mimic the Heads or gullwing. A reliable, rugged interconnect is then formed once FlexFrame's connector gets soldered between the host PCB and the adapter. Now, if only FlexFrame could just keep this Christmas's stash of electronic gadgets from going obsolete!
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机译：开玩笑的是，随着圣诞节购买季节的变化，一些COTS电子产品已过时，这使得军用项目很难在10年的时间内储备一些表面贴装技术IC。但是，互连系统公司（Interconnect Systems Inc.）的目标是通过其支持封装转换的FlexFrame适配器来阻止过时的Grinch。 FlexFrame旨在替代陈旧的J引线和SMT鸥翼IC封装，例如PLCC，QFP，SOIC和TSOP。rn由于其灵活的配置，该适配器被称为“ FlexFrame”，该适配器具有多种支脚高度，“独特”的间距和引脚位置，以及允许互连中心放置的载体窗口。高可用性FlexFrame设计可通过将PhosBronze销钉塞入FR4支架中来完成其任务，然后将其成形为模仿Heads或鸥翼。一旦FlexFrame的连接器焊接在主机PCB和适配器之间，便形成了可靠，坚固的互连。现在，如果只有FlexFrame可以避免圣诞节这个电子小物品的陈旧过时！
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