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首页> 外文期刊>Molecular Crystals and Liquid Crystals >Material Properties and Reliability of Anisotropic Conductive Films (ACFs) Modified by POSS for Chip-on-Glass Assembly
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Material Properties and Reliability of Anisotropic Conductive Films (ACFs) Modified by POSS for Chip-on-Glass Assembly

机译：POSS修饰的玻璃板上芯片组装各向异性导电膜（ACF）的材料性能和可靠性

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摘要

This paper describes the effect of polyhedral oligomeric silsesquioxane (POSS) in anisotropic conductive films (ACFs) composition on the material properties and reliability of ACF interconnections for chip-on-glass (COG) applications. Series of POSS modified ACFs containing 0wt%, 2wt%, 4wt%, 6wt% and 8wt% contents of octa-methacrylated POSS were formulated and characterized. The POSS added in the formulations favorably affected on the materials properties of ACFs by lowering coefficient of thermal expansion (CTE) and increasing modulus (E′). In addition, an increase in the POSS contents led to higher curing density and, as a result, thermo-mechanical properties of ACFs were improved. But, the adhesion strength of ACF materials was decreased with the POSS content, due to higher modulus originated from octa-functional POSS. The reliability performances of COG assemblies using POSS modified ACFs were also investigated. In conclusion, the materials properties and module reliability of COG assemblies were improved with increasing POSS content in ACFs.
机译：本文描述了各向异性导电膜（ACFs）中的多面体低聚倍半硅氧烷（POSS）对玻璃芯片（COG）应用中ACF互连的材料性能和可靠性的影响。配制并表征了一系列含量为0wt％，2wt％，4wt％，6wt％和8wt％的八甲基丙烯酸酯POSS改性ACF。通过降低热膨胀系数（CTE）和增加模量（Eâ€），配方中添加的POSS有利地影响了ACF的材料性能。另外，POSS含量的增加导致较高的固化密度，结果，改善了ACF的热机械性能。但是，ACF材料的粘合强度随POSS含量的增加而降低，这是由于八官能POSS产生的模量更高。还研究了使用POSS修改的ACF的COG组件的可靠性性能。总之，随着ACF中POSS含量的增加，COG组件的材料性能和模块可靠性得到了改善。

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