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首页> 外文期刊>Nuclear Instruments & Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment >Future semiconductor detectors using advanced microelectronics with post-processing, hybridization and packaging technology
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Future semiconductor detectors using advanced microelectronics with post-processing, hybridization and packaging technology

机译：未来的半导体探测器将使用具有后处理，杂交和封装技术的先进微电子技术

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摘要

Several challenges for tracking with semiconductor detectors in the high rate environment of future elementary particle physics experiments are discussed, such as reduction of spurious hits and ambiguities and identification of short-lived 'messenger' particles inside jets. To meet these requirements, the instrumentation increasingly calls on progress in microelectronics. Advanced silicon integration technology for 3D packaging now offers post-processing of CMOS such as wafer thinning to 50 μm and through-wafer vias of < 10 μm. These technologies might be applied to create new tracking detectors which can handle vertexing under the difficult rate conditions. The sensor layers can be only ～ 50 μm thick with low-noise performance and better radiation hardness by using small volume pixels. Multi-layer sensors with integrated coincidence signal processing could discriminate real tracks from various sources of background. Even in a ～ 400 μm thick 3D assembly, the vectors of tracks can be determined in ～ 10° bins and this multi-voxel device is called 'vector detector'. The measured vectors can be used to associate the main tracks to their vertices in the interaction region at high luminosity colliders and to establish an on-line, first-level trigger signature.
机译：讨论了在未来的基本粒子物理实验的高速率环境中使用半导体探测器进行跟踪所面临的一些挑战，例如减少杂散命中率和歧义性以及确定喷气机内寿命短的“信使”粒子。为了满足这些要求，仪器越来越要求微电子技术的进步。现在，用于3D封装的先进硅集成技术可提供CMOS的后处理功能，例如将晶圆减薄至50μm和小于10μm的晶圆通孔。这些技术可以用于创建新的跟踪检测器，该检测器可以处理困难速率条件下的顶点。通过使用小体积像素，传感器层的厚度仅为〜50μm，具有低噪声性能和更好的辐射硬度。具有集成符合信号处理功能的多层传感器可以从各种背景源中区分出真实轨迹。即使在约400μm厚的3D组件中，也可以在约10°的仓中确定轨迹的矢量，这种多体素设备被称为“矢量检测器”。测得的矢量可用于在高亮度对撞机的交互区域中将主轨迹关联到它们的顶点，并建立在线的一级触发信号。

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