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Thermal effect analysis on crosstalk and performance of optoelectronic transmitter modules for optical interconnects

机译：光互连的光电发射器模块的串扰和性能的热效应分析

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摘要

This paper presents thermal analysis on crosstalk and performance of optoelectronic transmitter modules and also demonstrates the thermal analysis for efficient heat dissipation for the transmitter modules. The thermal crosstalk model for analysis is based on interconnects parameters for vertically stacked and horizontally packaged optoelectronic transmitter modules. While the analytical expression is used to estimate the thermal critical frequency, f_(crit_th), above which signals become severely deteriorated, a Teflon-based thermal printed circuit board (PCB) has been designed for packaging the optoelectronic transmitter modules to ensure efficient heat dissipation. The thermal and performance analysis of the packaged modules show that the chips operate at temperatures below the f_(crit_th), which is apt for reliable data and signal transmission.
机译：本文介绍了对光电发射器模块的串扰和性能的热分析，还演示了对发射器模块进行有效散热的热分析。用于分析的热串扰模型基于垂直堆叠和水平封装的光电发射器模块的互连参数。虽然使用解析表达式来估算热临界频率f_（crit_th），在该频率上信号严重恶化，但已设计了基于聚四氟乙烯的热印刷电路板（PCB）来封装光电发射器模块，以确保有效的散热。封装模块的热性能分析表明，芯片在低于f_（crit_th）的温度下工作，这很适合可靠的数据和信号传输。

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  • 来源
    《Optical and quantum electronics》 |2017年第8期|277.1-277.12|共12页
  • 作者

    Ikechi Augustine Ukaegbu; M. Rakib Uddin; Jamshid Sangirov; Nga T. H. Nguyen; Tae-Woo Lee; Mu Hee Cho; Hyo-Hoon Park;

  • 作者单位

    Nano Electronic and Photonic Systems Laboratory, Department of Electrical Engineering, Korea Advanced Institute of Science and Technology, 335 Gwahangno (373-1 Guseong-dong), Yuseong-gu, Daejeon 305-701, Korea;

    Electrical and Electronic Engineering Programme Area, Universiti Teknologi Brunei, Jalan Tunku Link, Gadong, Brunei;

    Department of Information and Communications Engineering, Korea Advanced Institute of Science and Technology, 335 Gwahangno (373-1 Guseong-dong), Yuseong-gu, Daejeon 305-701, Korea,Present Address: Samsung Electronics Co. Ltd., Suwon, Korea;

    Department of Information and Communications Engineering, Korea Advanced Institute of Science and Technology, 335 Gwahangno (373-1 Guseong-dong), Yuseong-gu, Daejeon 305-701, Korea,Present Address: LSmtron, Dongan-Gu, Gyeonggi-do, Korea;

    Nano Electronic and Photonic Systems Laboratory, Department of Electrical Engineering, Korea Advanced Institute of Science and Technology, 335 Gwahangno (373-1 Guseong-dong), Yuseong-gu, Daejeon 305-701, Korea;

    Nano Electronic and Photonic Systems Laboratory, Department of Electrical Engineering, Korea Advanced Institute of Science and Technology, 335 Gwahangno (373-1 Guseong-dong), Yuseong-gu, Daejeon 305-701, Korea;

    Nano Electronic and Photonic Systems Laboratory, Department of Electrical Engineering, Korea Advanced Institute of Science and Technology, 335 Gwahangno (373-1 Guseong-dong), Yuseong-gu, Daejeon 305-701, Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Crosstalk; Thermal effects; Thermal PCB; Optoelectronic packaging; Optical interconnects; Optoelectronic transmitter module;

    机译：相声;热效应;导热PCB;光电包装;光学互连;光电发射器模块;

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