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Lateral carrier confinement and threshold current reduction in InGaN QW lasers with deeply etched mesa

机译:具有深蚀刻台面的InGaN QW激光器的横向载流子限制和阈值电流减小

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摘要

Shallow etch depths may contribute to a reduction in the optical gain of multiple quantum well (MQW) lasers through the lateral diffusion of carriers away from the region of greatest optical intensity. Deeply etched mesas can prevent this lateral diffusion, but this practice may itself contribute to a degradation of optical gain if the sidewalls are not effectively passivated. Simulation results considering the effects of surface recombination velocity (SRV) at the edge of etched active layers indicate that SRV must be reduced below approximately 105 cm/s in order for deep etch designs to provide benefit. Very few experimental studies quantify the efficiency of GaN surface passivation in terms of SRV. Further experimental studies are required to better assess the viability of deep etch MQW laser designs.
机译:浅蚀刻深度可能会通过载流子从最大光强度区域横向扩散而导致多量子阱(MQW)激光器的光学增益降低。深度蚀刻的台面可以防止这种横向扩散,但是如果侧壁没有得到有效的钝化,这种做法本身可能会导致光学增益的降低。考虑蚀刻活性层边缘的表面复合速度(SRV)影响的模拟结果表明,SRV必须降低到大约105 cm / s以下,以使深蚀刻设计受益。很少有实验研究根据SRV量化GaN表面钝化的效率。需要进行进一步的实验研究,以更好地评估深蚀刻MQW激光器设计的可行性。

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