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Circuitry of multiplexer-on-chip system within the micro-LED array manufacturing CMOS substrate

机译:用于制造CMOS基板的微型LED阵列中的片上多路复用器系统的电路

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摘要

In this paper, this research is after the process CMOS driver substrate. It is the use of A Benzocyclobutene polymer thin films planarization coating material in elements of the LED array manufacturing process. This CMOS driver circuit is a mode architecture that uses serial input data and parallel output data. It is the use of shift registers and latch circuit cell to form the overall system chip. The current density of the microcrystalline LED elements of each size is the same condition. The current density of a single 16m microcrystalline LED pixel driven by a 2.85V drive circuit board is about 2.69 mu A.
机译:本文中,这项研究是在对CMOS驱动器基板进行处理之后。它是将苯并环丁烯聚合物薄膜平坦化的涂料用于LED阵列制造工艺中。该CMOS驱动器电路是一种使用串行输入数据和并行输出数据的模式架构。它是利用移位寄存器和锁存电路单元构成整个系统芯片。各种尺寸的微晶LED元件的电流密度是相同条件。由2.85V驱动电路板驱动的单个16m微晶LED像素的电流密度约为2.69μA。

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