Are there any packaging trends weshould look out for?

首页> 外文期刊>Packaging News >Are there any packaging trends weshould look out for?

【24h】

Are there any packaging trends weshould look out for?

机译：我们应该注意什么包装趋势吗？

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

I think we are going to see more and more focus on packaging made from renewable materials. More use of renewable materials and recyclability will be the two big themes. The people who use materials that are not easily recyclable, or from renewable resources, are going to be the losers and the others are going to be the winners.

机译：我认为我们将越来越关注可再生材料制成的包装。更多使用可再生材料和可回收性将是两大主题。使用不容易回收或使用可再生资源的材料的人将成为失败者，其他人将成为胜利者。

著录项

来源
《Packaging News》 |2011年第11期|p.25|共1页
作者

展开▼
作者单位

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类
关键词

相似文献

外文文献
中文文献
专利

1. Weshould stay [J] . Caroline Bearder Plastics & Rubber Weekly . 2014,第Jana31期

机译：我们应该留下
2. Edible packaging: Sustainable solutions and novel trends in food packaging [J] . Petkoska Anka Trajkovska, Daniloski Davor, Cunha Nathan M. D., Food research international . 2021,第Feba期

机译：食用包装：可持续解决方案和食品包装的新趋势
3. Packaging Samples Metsa Board Highlights Recent Packaging Trends [J] . Ipw Internationale Papierwirtschaft Group Ipw Internationale Papierwirtschaft . 2019,第7a8期

机译：包装样品Metsa Loard突出了最近的包装趋势
4. Embedded Tutorial ET3: Packaging Trends, Die Package Co-Design Flow and Challenges [C] . Kothamasu Siva VLSI Design (VLSID), 2012 25th International Conference on . 2012

机译：嵌入式教程ET3：封装趋势，芯片封装协同设计流程和挑战
5. In-Package Thermal Pasteurization: Evaluating Performance of Flexible Packaging and Oxygen Sensitivity of Food Components [D] . ?Sonar, Chandrashekhar Ravindra 2020

机译：包装内的热巴氏灭菌：评估食品组分柔性包装和氧敏感性的性能
6. Bio-Based Sensors for Smart Food Packaging—Current Applications and Future Trends [O] . Carolina Rodrigues, Victor Gomes Lauriano Souza, Isabel Coelhoso, 2021

机译：基于生物的传感器用于智能食品包装 - 当前应用和未来趋势
7. Future Trend of Electronic Packages. Semiconductor Packaging Technology Trend. [O] . Gen MURAKAMI 1998

机译：未来的电子包趋势。半导体包装技术趋势。
8. Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability. [R] . Ghaffarian, R. 2014

机译：知识体系（BOK）用于无引线四方扁平无引线/底部端接元件（QFN / BTC）封装趋势和可靠性。

Are there any packaging trends weshould look out for?

摘要

著录项

相似文献

相关主题

期刊订阅