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首页> 外文期刊>Plasma Science & Technology >Heat Transfer During Radio Frequency Inductively Coupled Plasma Deposition of Tungsten
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Heat Transfer During Radio Frequency Inductively Coupled Plasma Deposition of Tungsten

机译：钨射频电感耦合等离子体沉积过程中的热传递

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摘要

Particle melting and substrate temperature are important in controlling deposited density and residual stress in thermal plasma deposition of refractory materials. In this paper, both the heating and cooling behaviours of tungsten particles inside a radio frequency inductively coupled plasma (ICP) and the plasma heat flux to the substrate were investigated. The distribution of the plasma-generated heat on device, powder injection probe, deposition chamber, and substrate was determined by measuring the water flow rate and the flow-in and flow-out water temperatures in the four parts. Substrate temperature was measured by a two-colour pyrometer during the ICP deposition of tungsten. Experimental results show that the heat flux to the substrate accounts for about 20% of the total plasma energy, the substrate temperature can reach as high as 2100 K, and the heat loss by radiation is significant in the plasma deposition of tungsten.
机译：颗粒熔化和基材温度对于控制耐火材料的热等离子体沉积中的沉积密度和残余应力很重要。在本文中，研究了射频感应耦合等离子体（ICP）中钨颗粒的加热和冷却行为以及等离子体对基板的热通量。通过测量四个部分中的水流速以及流入和流出的水温，确定在设备，粉末注入探针，沉积室和基板上产生的等离子体的热量分布。在钨的ICP沉积期间，通过双色高温计测量衬底温度。实验结果表明，流向衬底的热通量约占等离子体总能量的20％，衬底温度可高达2100 K，并且在钨的等离子体沉积中，辐射造成的热损失显着。

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