Future needs of the electronic industry predetermine nuances of freedom in such properties as thermal resistance, ultra-thin dielectrics, and small-hole formation to provide the foundation for MCM-L, PCMIA, smart cards, and high-density multilayer technologies. The cost advantage of organic substrates over ceramic has opened new avenues for PWBs. To respond to this opportunity, improvements in copper foil and laminate technology are crucial.
展开▼
